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NEWS TAGGED PTI
Thursday 21 November 2019
PTI chair sees FOPLP as alternative solution for IC scaling
FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that...
Tuesday 19 November 2019
Memory module makers, backend houses see demand pick up
Memory module manufacturers and backend service providers have seen end-market demand pick up recently, and are gearing up to meet 5G-driven demand with their sufficient supplies...
Wednesday 6 November 2019
Taiwan backend firms expanding testing capacities for 5G chipsets
Taiwan's backend specialists ASE Technology, Powertech Technology (PTI), King Yuan Electronics (KYEC) and Sigurd Microelectronics are all moving to ready additional capacities to...
Wednesday 23 October 2019
Backend house PTI stepping up capacity expansion
Backend house Powertech Technology (PTI) has disclosed it is building new production capacity to meet strong customer demand coming in the first quarter of 2020.
Wednesday 2 October 2019
IC backend service providers gearing up for AiP packaging
TSMC and other major Taiwanese IC backend service providers including ASE Technology and Powertech Technology (PTI) are ready to offer, or have exerted efforts to develop, AiP (antenna-in-package)...
Tuesday 1 October 2019
PTI advanced packaging draws new orders from Intel
Taiwan-based Powertech Technology (PTI) is working closely with Intel and will be engaged in the packaging services for the chip giant's upcoming QLC 3D NAND and heterogeneous chip...
Wednesday 25 September 2019
PTI to invest US$200 million to expand high-end testing capacity
Backend house Powertech Technology (PTI) plans to invest up to US$200 million to expand production capacity for high-end logic chips at its Suzhou (China) plant, according to market...
Wednesday 18 September 2019
PTI fan-out panel-level packaging attracts orders for HPC chips
Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking...
Wednesday 24 July 2019
PTI expects sales surge in 3Q19
Memory and logic IC backend house Powertech Technology (PTI) expects to post sequential growth in revenues for both the third quarter and the second half of 2019, judging from recovery...
Tuesday 23 July 2019
Memory backend firms see clear order visibility throughout 4Q19
Taiwan-based memory backend specialists have seen clear order visibility through the fourth quarter of 2019, as they have directly or indirectly tapped into the supply chains of major...
Thursday 2 May 2019
ASE panel-level packaging reportedly attracts orders from HiSilicon
IC backend house ASE Technology Holding's newly-developed fan-out panel-level packaging (FOPLP) technology has obtained orders from HiSilicon, according to sources familiar with the...
Wednesday 24 April 2019
PTI remains focused on FOPLP for advanced logic ICs
Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...
Wednesday 24 April 2019
Memory backend firm PTI expects flat or slight revenue growth in 2Q19
Powertech Technology (PTI) expects to post flat or slight sequential growth in revenues for the second quarter, followed by a substantial increase in the third quarter, accordin to...
Thursday 11 April 2019
ASE, PTI post revenue decreases in 1Q19
Major Taiwan-based backend houses ASE Technology Holding and Powertech Technology (PTI) have both reported sequential decreases of 22.1% and 13.2%, respectively, in consolidated revenues...
Tuesday 12 March 2019
Backend firms KYEC, Kingpak and GEM to see sales buck seasonal trends in 1H19
King Yuan Electronics (KYEC), Kingpak Technology and GEM Services are expected to see their sales growth exceed the seasonal average in the first half of 2019, outperforming their...
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