China-based EV company Xpeng released its latest vehicle architecture, Smart Electric Platform Architecture 2.0 (SEPA 2.0), on April 16. It said the system will shorten future models'...
Chinese mobile operators and telecom equipment providers are already engaged in 6G technology R&D, eyeing to lead in the next generation of wireless communication, according to...
ASML has filed to Taiwan's Ministry of Economic Affairs for R&D subsidies to fund the development and production of 2nm wafer optical measurement equipment, a report by Taiwan's...
Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program.
In the annual China IC Leadership Summit held on March 30, Wei Shaojun, a leading Chinese semiconductor scholar from Tsinghua University's School of Integrated Circuits, shared his...
Phison Electronics, which specializes in flash device controllers, is considering opening a R&D center in Malaysia to diversify its operations, according to company CEO K. S....
China-based LiDAR company Hesai Technology will expand its software effort in Chongqing, one of the automotive production hubs in the country. The company plans to establish a global...
China's Baidu recently announced the AI product "ERNIE Bot," which uses the second generation of Kunlun AI chip in its model. Besides focusing on AI chip development, Baidu is also...
NAND flash revenue will continue to decline into the first quarter of 2023 despite lower drops in memory ASPs, according to a recent TrendForce report.
R&D is the bedrock upon which an enterprise's commercial triumphs are built. Any disappointing outcome or inefficiency originating therefrom can spell out the company's economic...
United Microelectronics Corporation (UMC) held a groundbreaking ceremony for its Circular Economy & Recycling Innovation Center on March 17. Established at UMC's Fab 12A in Tainan,...
Samsung Electronics has recently restructured its research and development resources in Japan by establishing a comprehensive R&D center in Japan, Device Solution Research Japan...
Lin Jun-cheng, who previously worked in TSMC's advanced packaging and testing department, has been appointed as Samsung Electronics' VP of advanced packaging business, raising concerns...
Japan-based chip equipment maker Ulvac has announced an investment project for a new technology R&D site. The site will be located in South Korea to satisfy client demand.
