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NEWS TAGGED RAPIDUS
Monday 28 October 2024
Rapidus's Hokkaido 2nm fab nears completion, eyes 1.4nm production with government support
Rapidus has announced that its first wafer fab in Hokkaido, which is intended for 2mm chip production, is now 80% complete. The company also aims to progress to 1.4mm chips if its...
Wednesday 23 October 2024
Japan steps up collaborative efforts to tackle chip talent crunch in key regions of Kyushu and Hokkaido
The demand for semiconductor talent in Japan is increasing, especially in Kyushu, where TSMC is establishing wafer fabs, and in Hokkaido, where Rapidus plans to mass-produce 2nm chips...
Tuesday 22 October 2024
Rapidus estimates economic impact of JPY19 trillion in Hokkaido
Rapidus, the Japanese semiconductor manufacturer aiming for mass production of 2-nanometer (nm) chips, is making significant progress on its first factory located in Chitose, Hokkaido...
Monday 7 October 2024
Rapidus to build backend semiconductor manufacturing process R&D center
Rapidus has announced plans to establish a clean room at Seiko Epson's manufacturing facility in Chitose, Hokkaido, as well as a R&D center for semiconductor post-processing known...
Thursday 3 October 2024
Samsung reportedly shuts down equipment to cut losses amid foundry overcapacity crisis
Samsung Electronics is grappling with a foundry overcapacity crisis, despite its strategy of building capacity ahead of demand. According to reports from Chosun Biz and Bloomberg,...
Thursday 3 October 2024
Rapidus struggles to secure funding amidst 2nm chip ambitions
Rapidus, a Japanese semiconductor startup aiming to mass-produce 2nm chips by 2027, faces significant funding, technology, and market competitiveness challenges.
Monday 30 September 2024
PSMC's global ambitions face growing risks
After the collaboration between Powerchip Semiconductor Manufacturing Corporation (PSMC) and SBI collapsed—a development anticipated by industry insiders—attention has...
Friday 20 September 2024
Rapidus supply chain is taking shape; Taiyo Nippon Sanso to supply gases within 2024
The supply chain for Japanese semiconductor company Rapidus is preparing to start supplying goods as construction of Rapidus' wafer fab nears completion.
Wednesday 28 August 2024
Rapidus pursues US$690 million loan to achieve 2nm chip production by 2027
Rapidus, aiming to begin mass production of 2-nanometer chips in Japan by 2027, is seeking significant financial support for its trial production and eventual mass production.
Monday 19 August 2024
Japan faces financial resource issues following Kishida's resignation
Japanese prime minister Fumio Kishida is stepping down before the end of September 2024. Many policies from his administration require large budgets, including providing subsidies...
Friday 26 July 2024
Japan may offer more support for Rapidus 2nm chip ambition
The Japanese government is taking significant steps to support Rapidus in its efforts to become a global leader in semiconductor manufacturing. This includes providing financial support,...
Thursday 13 June 2024
Rapidus anticipates achieving a US$6.4 bln revenue target by 2030
Rapidus chairman Tetsuro Higashi said the Japanese pure-play foundry that aims to mass-produce 2nm chips could achieve its revenue target 10 years earlier than planned, as the AI...
Friday 31 May 2024
Japan considering ways to provide additional financial resources to Rapidus
As previous subsidies of a total of JPY920 billion (nearly US$6 billion) may not be sufficient to help Rapidus achieve its goal of mass-producing 2nm chips, Japan's Ministry of Economy,...
Wednesday 22 May 2024
Rapidus sees Esperanto as its latest customer after Tenstorrent
Japanese semiconductor foundry Rapidus, aiming to mass-produce 2nm chips, has announced a collaboration with US-based AI chip startup Esperanto Technologies to jointly develop desi...
Friday 10 May 2024
Rapidus gears up for advanced packaging and chiplet technologies as it races to 2nm production
Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
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