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    NEWS TAGGED ROADMAP
    Tuesday 1 September 2026
    Imec maps chip scaling to 2040, says AI's next gains need full-stack integration
    Imec has extended its advanced semiconductor roadmap into the early 2040s, arguing that sustained AI scaling will depend on closer integration across logic, memory, interconnects and...
    Tuesday 1 September 2026
    LGD launches PFAS exit roadmap, targets full phaseout by 2035
    LG Display (LGD) has introduced a new "PFAS-free" component verification process for suppliers as it prepares for expected European Union (EU) restrictions on PFAS, aiming to eliminate...
    Monday 31 August 2026
    TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration
    TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
    Friday 28 August 2026
    Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
    Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
    Friday 28 August 2026
    China's industrial reboot: AI, chips, robotics, 6G define next five years
    China is setting out a five-year industrial strategy centred on artificial intelligence (AI), semiconductors, 6G, robotics and advanced manufacturing, seeking to strengthen the country's...
    Thursday 27 August 2026
    Nvidia Vera Rubin drives 800VDC, lifts BBU demand
    Nvidia's GPU roadmap is pushing 800VDC into the spotlight as a key next-generation breakthrough, with battery backup modules (BBUs) set to gain in both quality and volume as high-density...
    Monday 24 August 2026
    Analysis: SK Hynix pushes beyond HBM with HBF and CPO
    SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
    Friday 21 August 2026
    SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
    SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
    Friday 21 August 2026
    Samsung holds off on High-NA EUV until 1nm production
    Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...
    Friday 14 August 2026
    SanDisk lays out multiyear NAND roadmap and AI storage targets at investor day

    SanDisk Corp used its August 13, 2026 investor day to detail a technology roadmap and a set of financial targets it says will carry...

    Friday 14 August 2026
    Rapidus targets 8-reticle interposers by 2030
    Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
    Thursday 13 August 2026
    Samsung delays High-NA EUV adoption until 1nm production in 2030
    Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...
    Thursday 13 August 2026
    SK Hynix expands EUV roadmap with High-NA tools and PSM adoption
    SK hynix said it is advancing its use of extreme ultraviolet (EUV) lithography for the mass production of next-generation DRAM, with high-numerical-aperture (High-NA) EUV equipment...
    Tuesday 11 August 2026
    Foxconn Research Institute maps four-stage LEO roadmap from relay satellites to AI-native networks

    Foxconn is extending decades of expertise in electronics manufacturing, system integration, and assembly, integration and testing (AIT)...

    Saturday 8 August 2026
    Interview: Lightmatter maps CPO future with Nvidia NVLink, Taiwan supply chain
    The 2026 OCP APAC Summit will take place in Taipei on August 11-12. Ahead of the event, Lightmatter founder and CEO Nicholas Harris spoke exclusively with DIGITIMES about the company's...
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    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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