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    NEWS TAGGED ROADMAP
    Friday 13 November 2026
    Nvidia's roadmap is set through 2028, but its tempo, talent bench were built around Huang
    Nvidia's product pipeline is locked in for the next two years, analysts say, but Jensen Huang's resignation calls into question the annual upgrade cadence he personally drove and exposes...
    Thursday 12 November 2026
    Jensen Huang resigns as Nvidia CEO; CFO Colette Kress named interim chief
    Nvidia co-founder Jensen Huang resigned as president, CEO and board member on November 12, effective immediately, the company's board said. He had led the company for 33 years, since...
    Thursday 22 October 2026
    Micron skips 4F² for 3D DRAM as CXMT pushes ahead
    Micron does not plan to commercialize 4F² DRAM even as Chinese rival ChangXin Memory Technologies (CXMT) advances the technology, saying the architecture offers limited benefits...
    Friday 16 October 2026
    Holtek targets higher-value MCU markets with AI server cooling orders set to lift 2027 revenue
    Taiwan-based microcontroller (MCU) manufacturer Holtek Semiconductor unveiled its 2026 product roadmap on October 15, focusing on four core areas: smart protection, green energy and...
    Thursday 15 October 2026
    Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
    On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
    Saturday 3 October 2026
    Biren readies BR20X, sharpening China's AI GPU challenge to Nvidia
    Biren Technology is preparing its next-generation GPU for mass production, advancing a domestic AI accelerator roadmap built around broader low-precision support and locally available...
    Tuesday 29 September 2026
    Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
    Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...
    Tuesday 29 September 2026
    South Korea looks beyond high-nickel NCM in battery push
    South Korea is broadening its battery strategy beyond high-nickel NCM, stepping up investment in sodium-ion, all-solid-state and lower-cost technologies after acknowledging that its...
    Thursday 24 September 2026
    Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding
    Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...
    Thursday 24 September 2026
    Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap
    Alibaba has formally unveiled its self-developed Zhenwu V900 AI chip at the 2026 Apsara Conference, with CEO Eddie Wu describing the T-Head Semiconductor-designed processor as "China's...
    Tuesday 22 September 2026
    Alibaba speeds V900 rollout, targeting 20GW of data centers
    Alibaba Group is accelerating the rollout of its next-generation Zhenwu V900 accelerator by about six months as it expands a vertically integrated computing platform spanning processors,...
    Tuesday 22 September 2026
    Samsung weighs 4nm expansion as HBM4 demand strains capacity

    Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full...

    Friday 18 September 2026
    Nvidia roadmap shifts to rack-scale AI with Rubin Ultra

    Nvidia's latest AI platform roadmap is taking shape, with supply chain sources saying the company will enter a heavy shipment phase...

    Thursday 17 September 2026
    Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
    Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its effort to scale AI computing beyond the limits of individual...
    Wednesday 9 September 2026
    Qualcomm to build custom AI inference chips for AWS
    Qualcomm's multi-generation agreement to build customized AI inference silicon and optical interconnects for Amazon gives the company something its data center roadmap has lacked since...
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    BIZ FOCUS
    Nov 13, 08:00
    APD Opens Shenzhen Facility, Advancing Dual-Plant Integration and Smart Manufacturing
    Thursday 5 November 2026
    Can Wearable Health Devices Reflect Traditional Chinese Medicine Concepts?
    Tuesday 3 November 2026
    NVIDIA CEO and Sweden's Technology Leaders Discuss Compute's Next Chapter
    Friday 30 October 2026
    Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026