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    Hermes-Epitek eyes CPO test revenue in 2027
    6h 54min ago
    YMTC wins German injunctions against Micron in patent dispute
    6h 54min ago
    China-made batteries keep US storage costs low as de-risking raises concerns
    6h 54min ago
    Alibaba’s Qwen speeds up self-improvement as Qwen4 training begins
    6h 55min ago
    LG Group and Microsoft deepen AI partnership across data centers and physical AI
    6h 55min ago
    NEWS TAGGED ROADMAP
    Tuesday 22 September 2026
    Alibaba speeds V900 rollout, targeting 20GW of data centers
    Alibaba Group is accelerating the rollout of its next-generation Zhenwu V900 accelerator by about six months as it expands a vertically integrated computing platform spanning processors,...
    Tuesday 22 September 2026
    Samsung weighs 4nm expansion as HBM4 demand strains capacity

    Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full...

    Friday 18 September 2026
    Nvidia roadmap shifts to rack-scale AI with Rubin Ultra

    Nvidia's latest AI platform roadmap is taking shape, with supply chain sources saying the company will enter a heavy shipment phase...

    Thursday 17 September 2026
    Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
    Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its effort to scale AI computing beyond the limits of individual...
    Wednesday 9 September 2026
    Qualcomm to build custom AI inference chips for AWS
    Qualcomm's multi-generation agreement to build customized AI inference silicon and optical interconnects for Amazon gives the company something its data center roadmap has lacked since...
    Saturday 5 September 2026
    TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain
    TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...
    Friday 4 September 2026
    Acer wowed IFA with AI, gaming hardware
    As Acer marks its 50th anniversary in 2026, Chairman and CEO Jason Chen said at the company's next@acer global press event during IFA in Berlin, Germany, that the PC maker's four future...
    Wednesday 2 September 2026
    IBM's quantum pitch to chip audience: bottleneck is now manufacturing
    IBM's case for quantum computing no longer rests on physics. At Semicon Taiwan 2026 on September 1, the company's argument was that AI has outrun what silicon can supply, that no amount...
    Wednesday 2 September 2026
    Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference
    China-based ICY Tech has introduced its uHBM and uLPU AI inference architectures, extending persistent MRAM computing from validation silicon into a product roadmap spanning compute-memory...
    Tuesday 1 September 2026
    Imec maps chip scaling to 2040, says AI's next gains need full-stack integration
    Imec has extended its advanced semiconductor roadmap into the early 2040s, arguing that sustained AI scaling will depend on closer integration across logic, memory, interconnects and...
    Tuesday 1 September 2026
    LGD launches PFAS exit roadmap, targets full phaseout by 2035
    LG Display (LGD) has introduced a new "PFAS-free" component verification process for suppliers as it prepares for expected European Union (EU) restrictions on PFAS, aiming to eliminate...
    Monday 31 August 2026
    TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration
    TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
    Friday 28 August 2026
    Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
    Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
    Friday 28 August 2026
    China's industrial reboot: AI, chips, robotics, 6G define next five years
    China is setting out a five-year industrial strategy centred on artificial intelligence (AI), semiconductors, 6G, robotics and advanced manufacturing, seeking to strengthen the country's...
    Thursday 27 August 2026
    Nvidia Vera Rubin drives 800VDC, lifts BBU demand
    Nvidia's GPU roadmap is pushing 800VDC into the spotlight as a key next-generation breakthrough, with battery backup modules (BBUs) set to gain in both quality and volume as high-density...
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    BIZ FOCUS
    Sep 22, 08:00
    Macronix Secure Memories Build Hardware Defenses for EU CRA
    Tuesday 22 September 2026
    AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities
    Tuesday 22 September 2026
    AT&S Unveils Strategy to Drive AI Growth
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
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