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NEWS TAGGED SEAJ
Thursday 9 September 2010
Chip equipment billings climb 22% in 2Q10, says SEMI
Worldwide semiconductor manufacturing equipment billings reached US$9.11 billion in the second quarter of 2010, according to SEMI. The billings figure is 22% higher than that in the...
Thursday 19 August 2010
Japan chip gear book-to-bill climbs to 1.53 in July 2010, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.53 in July 2010, compared to 1.40 in the prior month, according to the Semiconductor Equipment...
Wednesday 21 July 2010
Chip gear book-to-bill ratios climb in June 2010
Japan's semiconductor production equipment manufacturers have reported a book-to-bill ratio of 1.40 for June, up from 1.13 in May, according to the Semiconductor Equipment Association...
Monday 21 June 2010
SEMI, SEAJ book-to-bill ratios stay strong in May 2010
Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...
Monday 24 May 2010
Japan chip gear book-to-bill slips to 1.07 in April 2010, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.07 in April 2010, compared to 1.17 in the prior month, according to the Semiconductor Equipment...
Tuesday 20 April 2010
Japan chip gear book-to-bill ratio at 1.17 in March 2010, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.17 in March 2010, down from 1.34 in February but up significantly from the record level of 0.30...
Sunday 21 March 2010
Chip-gear book-to-bill almost flat in February 2010
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.22 in February 2010 compared to 1.23 in January, according to SEMI.
Thursday 11 March 2010
Global semiconductor equipment sales down 46% in 2009, says SEMI
Worldwide sales of semiconductor manufacturing equipment totaled US$15.92 billion in 2009, representing a 46% decline compared to US$29.52 billion posted in 2008, according to SEMI...
Thursday 21 January 2010
Japan chip equipment book-to-bill reaches 1.30 in December 2009, says SEAJ
Japan-based semiconductor equipment manufacturers posted about 77.39 billion yen (US$844 million) in orders in December 2009 and a book-to-bill ratio of 1.30, according to Semiconductor...
Wednesday 13 January 2010
Japan chip-gear sales to grow 38% in FY 2010, says SEAJ
Sales of Japan-made semiconductor and flat-panel display (FPD) equipment are forecast to reach 1.12 trillion yen (US$12.3 billion) in fiscal year 2010, up 37.7% from 813 billion yen...
Friday 18 December 2009
Japan chip gear book-to-bill slips to 1.18 in November 2009
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.18 in November 2009 compared to the prior month's level of 1.28, according to Semiconductor Equipment...
Thursday 19 November 2009
Japan chip-gear book-to-bill flat in October 2009, says SEAJ
Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.28 in October 2009, similar to the prior month's level, according to data gathered by the Semiconductor...
Tuesday 20 October 2009
Japan chip equipment orders down 22% on year in September 2009, says SEAJ
Japan-based semiconductor equipment manufacturers received 61.567 billion yen (US$682.92 million) in orders in September 2009, down 22.2% from the same period in 2008, according to...
Friday 18 September 2009
Japan chip equipment orders continue sequential growth in August 2009, says SEAJ
Japan-based semiconductor equipment manufacturers posted about 55.46 billion yen (US$608 million) in orders in August 2009 (three-month average basis), and a book-to-bill ratio of...
Thursday 20 August 2009
Japan chip equipment book-to-bill reaches 1.34 in July, says SEAJ
Japan-based semiconductor equipment manufacturers posted about 43.78 billion yen (US$464 million) in orders in July 2009 (three-month average basis) and a book-to-bill ratio of 1.34,...