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Thursday 21 October 2021
ASML gearing up for EUV equipment boom
With Intel announcing plans to adopt ASML's high-NA EUV machines in its post-nanometer process technology that is expected to be ready for production by 2025, ASML has disclosed it...
Friday 15 October 2021
Will foundry expansions lead to capacity glut?
Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...
Thursday 14 October 2021
Chip delivery times reportedly reach nearly 22 weeks
The impact of government-led power restrictions on China's local industry supply chains is threatening to prolong delivery lead times for ICs, according to industry sources in Chin...
Monday 27 September 2021
OSATs in Suzhou concerned more about labor shortage than power reduction
Taiwan's OSATs have seen their plants in Suzhou, Jiangsu province little affected by a power supply cut enforced by China under its carbon reduction policy, but they are more concerned...
Thursday 23 September 2021
Military applications rising as niche market for GaN-on-SiC RF components, says Transcom
GaAs device and foundry company Transom expects military-use radars and other defense systems to emerge as niche application outlet for GaN-on-SiC RF components and modules including...
Thursday 16 September 2021
Monolithic/heterogeneous integration to drive Silicon 4.0: Q&A with Etron chairman Nicky Lu
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
Tuesday 14 September 2021
SMIC to build additional, considerable 28nm and above process capacity
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Wednesday 18 August 2021
China top-3 OSATs hike quotes by 20-30% for rush orders
China's top-3 backend houses JCET, Tongfu Microelectronics, and Tianshui Huatain Technology are all set to gain big from robust packaging demand in the second half of the year, having...
Wednesday 4 August 2021
Taiwan backend houses bracing for robust China mature-node chips demand
Taiwan-based IC backend houses are gearing up for robust packaging demand for mature-node chips from foundries in China, as the supply of such chips is increasingly short of demand...
Monday 26 July 2021
TSMC in early stage talks over new German fab possibility
TSMC is in the early stages of discussions with clients over the feasibility of setting up a new fab in Germany, chairman Mark Liu told shareholders at the company's annual general...
Monday 19 July 2021
Highlights of the day: China keen to improve IC self-sufficiency
China, which has been relying heavily on semiconductor imports, is keen to improve it IC self-sufficiency. But DIGITIMES Asia president Colley...
Wednesday 7 July 2021
TSMC under US pressure over expansion at China fab
TSMC is coming under pressure from the US over its plan to expand foundry capacity in China, according to industry sources.
Thursday 18 February 2021
TSMC could set up fab in Europe
TSMC could set up an advanced wafer fab in Europe, where demand for leading-edge chip fabrication is promising, according to industry observers.
Thursday 7 January 2021
China to fall far short of IC self-sufficiency goal by 2025, says IC Insights
IC Insights has forecast that China-produced ICs will represent only 19.4% of the country's IC market in 2025, a fraction of the country's "Made in China 2025" goal of 70%.
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research