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NEWS TAGGED SEMI
Friday 16 December 2011
IC packaging materials market to reach US$25.7 billion by 2015, says SEMI
The market for semiconductor packaging materials, including thermal interface materials, is expected to reach US$22.8 billion in 2011 and grow to US$25.7 billion by 2015, according...
Wednesday 7 December 2011
Lite-On Semi reports decline in November revenues
Lite-On Semiconductor has announced that consolidated revenues for November 2011 amounted to NT$636 million (US$21.1 million), down 16.1% on year and down 4.3% on month. The firm...
Thursday 24 November 2011
Win Semi set for OTC listing, says report
GaAs IC foundry Win Semiconductors is scheduled to be listed on Taiwan's over-the-counter (OTC) market on December 13 at NT$32 (US$1.05) per share, according to a Chinese-language...
Friday 18 November 2011
North America October chip-gear orders up 1%, says SEMI
North America-based manufacturers of semiconductor equipment posted US$939.4 million in orders in October 2011 (on a three-month average basis), up 1.4% from the revised September...
Friday 4 November 2011
Win Semi sets sales record for sixth straight month
Win Semiconductors, a major GaAs IC foundry, enjoyed another month of record sales in October thanks to continued-strong shipments of products used in smartphones.
Friday 21 October 2011
SEMI book-to-bill falls again in September
North America-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September 2011, declining for the fifth month in a row.
Thursday 13 October 2011
Silicon wafer shipments to post single-digit growth in 2012 and 2013, says SEMI
Silicon wafer shipments to the global semiconductor industry are expected to see flat growth in 2011, following 2010 when shipments rebounded 39% to 9.12 billion square inches, according...
Thursday 22 September 2011
PV equipment book-to-bill ratio drops below parity in 2Q11, says SEMI
SEMI has reported that worldwide photovoltaic manufacturing equipment billings reached US$2.03 billion for the quarter ended on June 30, 2011. Billings increased 17% sequentially,...
Friday 16 September 2011
SEMI book-to-bill ratio slips to 0.80 in August
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...
Friday 9 September 2011
450mm and EUV linked with uncertainty, says SEMI
The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. However, uncertainty with EUV rollout has exacerbated the...
Wednesday 7 September 2011
Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI
Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...
Wednesday 7 September 2011
SEMICON Taiwan 2011: Major IDMs participate for procurement talks
Major IDMs including Panasonic Semiconductor, Philips, Renesas Electronics and Toshiba are being invited to hold face-to-face procurement talks with Taiwan-based suppliers of chemicals,...
Wednesday 7 September 2011
Chip equipment billings up 31% in 2Q11, says SEMI
Worldwide semiconductor manufacturing equipment billings reached US$11.92 billion in the second quarter of 2011, according to SEMI. The billings figure is 1% lower than that in the...
Wednesday 7 September 2011
SEMI downgrades forecast for 2011 fab-tool spending, but still sees record year
SEMI's latest statistics suggests that capital expenditure will increase to US$41.1 billion in 2011, the highest on record, according to the industry association. The prediction is...
Thursday 1 September 2011
China government to promote semi industry consolidation, says Digitimes Research
According to a recently published Digitimes Research...