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NEWS TAGGED SEMICON TAIWAN 2024
Monday 30 September 2024
Entering the trillion-transistor era: A semiconductor revolution unfolds
In early September, SEMICON Taiwan 2024 was held in Taipei. This annual global semiconductor event gathered leading semiconductor companies and industry elites from around the world...
Thursday 26 September 2024
Quebec's strategy for closing America's semiconductor talent gap
The existing competitive edge has prompted the birth of a semiconductor Innovation Zone in the city of Bromont, located in Quebec, Canada. World leaders like IBM, Teledyne DALSA,...
Wednesday 18 September 2024
7 key takeaways from SEMICON Taiwan 2024—and how it differs from COMPUTEX
SEMICON Taiwan 2024, held in early September, provided a glimpse into the future of the semiconductor industry, from advanced memory technologies to international partnerships in...
Friday 13 September 2024
Henkel Adhesives helps customers unlock growth for next-generation advanced packaging
SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The...
Wednesday 11 September 2024
Texas woos Taiwan's chip giants with US$700M fund and tax perks
In July 2024, Texas Governor Greg Abbott visited Taiwan to strengthen bilateral ties between the two regions, aiming to attract Taiwanese semiconductor companies to set up operations...
Tuesday 10 September 2024
Largan subsidiary TAC expands business beyond SiC crystal growth
Taiwan Applied Crystal (TAC), a subsidiary of Largan Precision in which the Taiwanese lens maker holds a more than 70% stake, has just begun seeing its years-long investment in silicon...
Tuesday 10 September 2024
Collaboration between competitors needed to support AI development
Cloud AI was a key topic at SEMICON Taiwan 2024, which just concluded last week, but the focus was not just on increasing computing power. A lot of in-depth discussions were devoted...
Tuesday 10 September 2024
Advanced packaging focuses on CoWoS, 3D IC, and FOPLP at SEMICON Taiwan 2024
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
Monday 9 September 2024
Equipment makers anticipate golden decade as FOPLP set for mass production in 2H25
SEMICON Taiwan 2024 has just concluded, and industry observers have noted one key difference compared to previous years: the number of equipment manufacturers participating, which...
Monday 9 September 2024
Naura, ACM grab attention at SEMICON, AMEC absent
SEMICON Taiwan 2024 has officially launched with global semiconductor equipment and materials suppliers in attendance.
Monday 9 September 2024
Exploring UK semiconductor powerhouse from automotive innovations to satellite communications
The UK continues to further its automotive and other industries while investing heavily in high-tech sectors. Harnessing its extensive academic expertise, the country is making significant...
Monday 9 September 2024
ITRI, SIIQ, MOEA aim to build tenacious semiconductor ecosystem
On September 4, 2024, ITRI, SIIQ, and the Kyushu Semiconductor Human Resource Development Consortium jointly organized a symposium aimed at engaging in scholarly and technical exchanges...
Monday 9 September 2024
A new era of co-innovation between Taiwan and Canada starts with AI and semiconductors
The Canada-Taiwan Semiconductor Co-Innovation Forum, held on September 6 in Hsinchu during the week of SEMICON Taiwan 2024, attracted Taiwanese semiconductor supply chain companies...
Monday 9 September 2024
High-NA EUV adoption hampered by cost, mass-production on track for 2026
Despite ASML being the sole provider of high-NA EUV systems, customer adoption is affected by the high price, as ASML aims to begin mass production of the system by 2026.
Monday 9 September 2024
Samsung and SK Hynix vie for HBM dominance as both advance 16-layer technology
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research