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NEWS TAGGED SEMICONDUCTOR EQUIPMENT
Monday 11 March 2013
Csun looks to post revenues of NT$4 billion in 2013
Csun Manufacturing, which mainly produces equipment used in the production of LCD panels and PCBs, has seen its order visibility extend to three months with revenues for all of 2013...
Wednesday 6 March 2013
Hermes sees order visibility extend to 6 months
Hermes Microvision, a Taiwan-based provider of E-beam inspection tools and solutions used in semiconductor production, has reported that its order visibility has extended to six months...
Tuesday 26 February 2013
Equipment maker GPTC posts significant revenue and profit growth in January
Buoyed by its recent acquisition of a chemical material supplier, as well as brisk demand from IC foundries, Grand Plastic Technology (GPTC) has reported significant on-year growth...
Friday 22 February 2013
SEMI book-to-bill ratio rises above parity
Having stayed below parity for the past seven months, the SEMI book-to-bill ratio for US manufacturers of semiconductor equipment climbed to 1.14 in January 2013.
Friday 22 February 2013
Equipment maker Csun sees book-to-bill ratio rise
Taiwan-based Csun Manufacturing has seen orders for LCD, PCB and semiconductor equipment rebound bringing the company's book-to-bill ratio to 1.5-1.8 recently, according to industry...
Thursday 31 January 2013
Scientech deepens development of 3D IC, wafer-level packaging equipment
Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to...
Wednesday 30 January 2013
KLA-Tencor intros new e-beam inspection system
KLA-Tencor has announced a new electron-beam inspection system, the eS805, which is already shipped to leading logic and chip manufacturers.
Monday 28 January 2013
North America fab tool book-to-bill continues growth, says SEMI
North America-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.92 in December 2012, up for the third consecutive month, according to SEMI.
Thursday 24 January 2013
TSMC demands suppliers deliver equipment in advance for 28nm node
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly has demanded its equipment suppliers deliver in advance the front-end equipment needed for its 28nm process due to brisk...
Thursday 24 January 2013
Japan chip gear ratio rises above parity in December 2012, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 on a three-month average basis in December 2012, up from 0.89 the month before, according...
Wednesday 23 January 2013
Scientech application for TSE listing approved
Scientech, a Taiwan-based distributor of semiconductor equipment, has received approval for its application to be listed on the Taiwan Stock Exchange (TSE). Official listing is scheduled...
Thursday 17 January 2013
Display and DRAM industries ready to rebound, says Advantest Taiwan president
The display and DRAM industries have both hit bottom, and are likely to stage a rebound in 2013, according to Advantest Taiwan president CH Wu.
Wednesday 16 January 2013
Equipment supplier Mirle eyeing 30% growth in orders from China
Mirle Automation is set to see orders for its automation equipment from China surge another 30% in 2013 as it recorded in a year earlier. The company currently also has a backlog...
Tuesday 15 January 2013
Grand Pacific Technology to post EPS of over NT$13 in 2012
Semiconductor equipment maker Grand Plastic Technology (GPTC) saw its revenues rally 41.7% to NT$1.57 billion (US$54.27 million) in 2012. EPS for the year is expected to reach NT$13-14,...
Tuesday 25 December 2012
IC-equipment supplier Scientech plans listing on TSE
Scientech, a Taiwan-based distributor of semiconductor equipment, has revealed plans to list its shares on the Taiwan Stock Exchange (TSE) after Lunar New Year in February 2013....