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NEWS TAGGED SEMICONDUCTOR EQUIPMENT
Wednesday 19 August 2009
TSMC spends more on equipment
Taiwan Semiconductor Manufacturing Company (TSMC) has announced a total of 20 purchases of machinery equipment, worth NT$17.72 billion (US$537 million), since July 13.
Wednesday 19 August 2009
North America chip equipment orders up 62% sequentially in July, says SEMI
North America-based manufacturers of semiconductor equipment posted US$569.7 million in orders in July 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...
Tuesday 18 August 2009
SPP buys Aviza assets for MEMS expansion
California-based semiconductor equipment supplier Aviza Technology, which in June filed for Chapter 11 bankruptcy, has inked a deal to sell assets to Sumitomo Precision Products (SPP)...
Thursday 13 August 2009
UMC steps up equipment purchases to ramp 40nm capacity
United Microelectronics Corporation (UMC) has spent around NT$4 billion (US$121.6 million) over the past month to purchase equipment, in a move to ramp up its 40nm-class process nodes...
Wednesday 12 August 2009
TSMC board allocates US$50 million for solar investment
Taiwan Semiconductor Manufacturing Company (TSMC) has announced its board of directors on August 11 approved plans to allocate US$50 million for possible investment in solar energy-related...
Wednesday 5 August 2009
Automation equipment makers to face servo motor shortage
Despite optimism about increased demand from customers, automation-equipment makers are likely to be hit by a shortage of servo motors in the latter half of August 2009, according...
Tuesday 4 August 2009
Equipment makers gearing up for customer expansion projects
With foundries, IC backend houses and panel makers revising upward their 2009 capex, Taiwan-based semiconductor and LCD equipment makers are gearing up for an expected uptick in orders...
Tuesday 4 August 2009
Top semiconductor suppliers sales surge 21% in 2Q09, says IC Insights
The top-20 semiconductor companies, in total, registered a second-quarter 2009 sales increase of 21%. This was a 37-point swing compared to the first-quarter results when the same...
Friday 31 July 2009
Memory backend house PTI upbeat about 3Q09; raises capex
Powertech Technology (PTI) has increased its 2009 capex to NT$5 billion (US$151.97 million) to fund new backend equipment purchases, revising its original plan of NT$3 billion, according...
Wednesday 29 July 2009
Packaging material supplier Laser Tek to see 30% sales growth in July
Taiwan-based Laser Tek is likely to see July 2009 revenues up 30% sequentially, primarily driven by its equipment product lines, according to company sources. Specializing in SMD...
Thursday 23 July 2009
Japan chip equipment bookings rise 37% in June, says SEAJ
Japan-based semiconductor equipment manufacturers posted about 35.58 billion yen (US$377.32 million) in orders in June 2009 (three-month average basis) and a book-to-bill ratio of...
Thursday 23 July 2009
Cymer installs 60-90W light source at Nikon
Cymer's XLR 600ix light source has been integrated into a scanner at Nikon, and successfully installed at the Asia-based chipmaker. The 60-90 watt (60-90W) immersion light source...
Wednesday 22 July 2009
North American chip equipment orders continue recovery in June, says SEMI
North America-based manufacturers of semiconductor equipment posted US$323.4 million in orders in June 2009 (three-month average basis) and a book-to-bill ratio of 0.77, according...
Tuesday 21 July 2009
All Ring Tech to rely on LED packaging equipment for revenue growth
All Ring Tech, a Taiwan-based maker of equipment used in production of passive components and TFT-LCD panels as well as IC packaging, has extended its production to LED packaging...
Wednesday 15 July 2009
Elpida reportedly developing die-shrink 50nm process without expenditure on new tools
Elpida Memory has been quietly developing a technology based on its existing 65nm equipment for DRAM production, to enable a die shrink to 50nm, industry sources have claimed. The...