The Taiwan government should encourage its local chipmakers to collaborate with their China-based peers to create a win-win for both sides' semiconductor industries, according to...
Advanced Micro-Fabrication Equipment (AMEC) aims to grow its revenues to CNY2 billion (US$290.4 million) in 2020, and is striving to be among the world's top-5 semiconductor equipment...
RDA Microelectronics has seen cumulative shipments of its chip solutions for IoT applications top one million units, according to the China-based chip provider.
Universal Scientific Industry (Shanghai), a subsidiary of Advanced Semiconductor Engineering (ASE), has reported net profits of CNY806 million (US$116.98 million) for 2016, increasing...
Shanghai Zhaoxin Semiconductor is scheduled to roll out its in-house developed ZX-D series processors that will be built using a 28nm process technology by Shanghai Huali Microelectronics...
ChipMOS Technologies has announced the completion of its previously-disclosed equity interest transfer to a group of investors led by Tsinghua Unigroup.
MEMS sensor startup Shanghai Quality Sensor Technology (QST) saw its shipments jump five-fold in 2016 compared to the previous year, driven by the fast-growing market for accelerators,...
ASML has signed an MoU with Shanghai Micro Electronics Equipment (SMEE), under which ASML and SME will initially explore the potential sourcing of certain modules for ASML lithography...
SEMICON China 2017 is taking place at the Shanghai New International Expo Centre (SNIEC) from March 14-16. SEMI expects over 60,000 attendees at the annual trade show that will feature...
China-based IC foundries, such as Shanghai Huali Microelectronics (HLMC), are evaluating plans to offer FD-SOI process technology since they are less competitive in the mainstream...
United Test and Assembly Center (UTAC), a Singapore-based provider of test and assembly services for ICs, has announced plans to discontinue its operations in Waigaoqiao, Shanghai.
With Siltronic reportedly drawing interest from China's state-backed industry group, the global silicon wafer industry is expected to go through a period of consolidation in 2017.
ChipMOS Technologies and Tsinghua Unigroup have announced an agreement to form a joint venture and to mutually terminate Tsinghua Unigroup's earlier private placement plan.