Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in...
Major IDMs like STMicroelectronics, Infineon, Onsemi, and Wolfspeed have plans to ramp up silicon carbide (SiC) device production. While the companies believe the technology will...
A recent patent lawsuit filed by US-based gallium nitride (GaN) technology specialist Efficient Power Conversion Corp (EPC) against China's top GaN devices vendor Innoscience Technology...
STMicroelectronics (ST) announced it would form a joint venture with China-based counterpart Sanan Optoelectronics to secure a share in China's rapidly growing vehicle and industrial...
Nidec and Renesas Electronics have agreed to collaborate on the development of semiconductor solutions for a next-generation e-axle (X-in-1 system) that combines an electric vehicle...
Member firms of the Foxconn (Hon Hai Precision Industry) camp have completed their initial deployments in the third-generation compound semiconductor SiC (silicon carbide) field,...
Takeshi Kataoka, SVP and GM of Renesas Electronics' automotive solutions is in Taiwan for the second time this year and will deliver a remark at a Computex 2023 forum on Friday (June...
Sino-American Silicon Products (SAS), which has affiliates such as Actron Technology, GlobalWafers, and Globitech, is extending its footprint in the silicon carbide (SiC) semiconductor...
The anticipated third-generation silicon carbide (SiC) and gallium nitride (GaN) semiconductor market demand has sparked Taiwan's high-tech industry's interest, with more enterprises...
It remains hard to judge when Chinese suppliers of silicon carbide (SiC) substrates and wafers will launch a price reduction campaign after some of them have secured long-term supply...
In response to increased competition from Chinese competitors, SiC substrate suppliers from Europe and the US have slightly lowered prices for Asian customers, according to industry...
Onsemi is looking to double down its SiC chip production and move from Fab Liter to Fab Right strategy, building end-to-end chip production when demand for EVs rapidly increases.
Infineon Technologies and Hon Hai Technology (Foxconn) have signed an agreement to work on silicon carbide (SiC) development for electric vehicles (EV).
Apart from its TSMC-led silicon-based semiconductor ecosystem, Taiwan also plays a crucial role in the development of compound semiconductors, including the second-generation semiconductors...
Power semiconductor devices such as SiC MOSFETs, IGBT, and GaN are experiencing increasingly fierce competition in EV, charging pile, energy storage, and renewable energy applications,...
