Beijing's push to dominate third-generation semiconductor technology is taking shape along divergent paths, with silicon carbide (SiC) development now accelerating after overcoming...
MSScorps marked a significant milestone with a beam-raising ceremony for its SAC-TEM Center on April 2, signaling its commitment to advancing material analysis for next-generation...
To strengthen academic exchange and collaboration between Taiwan and Japan, the renowned Japanese research institute RIKEN has signed a memorandum of understanding (MoU) with Taiwan's...
Ennostar is rapidly diversifying from LED manufacturing into optical communication as demand for high-speed modules accelerates due to AI server requirements. The company has developed...
ASE and National Cheng Kung University (NCKU) have presented the results of their joint development for semiconductor technology over the past year, with both sides committing to...
The rise of AI data centers is fueling demand for co-packaged optics (CPO) and silicon photonics (SiPh), compelling optical communications firm Browave to fast-track its CPO development...
At a GTC media roundtable, when pressed on whether application-specific integrated circuits (ASICs) threaten Nvidia's AI dominance, CEO Jensen Huang didn't mince words.
The Malaysian government recently announced a technology licensing agreement worth US$250 million with silicon intellectual property (IP) powerhouse Arm. The deal aims to assist the...
Nvidia's preparedness to use silicon photonics (SiPh) technology signifies its swift integration into the cloud AI sector in a short period. Partners, including Broadcom, Marvell,...
Nvidia CEO Jensen Huang officially announced the Spectrum-X and Quantum-X silicon photonic (SiPh) network switches, enabling AI factories to connect millions of GPUs across different...
Infineon has announced its next-generation battery backup unit (BBU) roadmap for AI data centers, featuring a scalable lineup from 4kW to what it calls the world's first 12kW BBU...
Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move aimed at replacing the costly silicon interposers currently...
The US has initiated a Section 301 investigation into China's mature semiconductor processes and third-generation silicon carbide (SiC) semiconductors. Supply chain operators state...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...
CDIL Semiconductors and Infineon Technologies have signed a Memorandum of Understanding (MoU) to collaborate on power semiconductor solutions tailored to India's growing needs in...
