Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...
Qualcomm's just-unveiled Snapdragon 778G chipset with integrated X52 5G modem is manufactured using TSMC's 6nm process technology, and is designed mainly for midrange 5G-capable Android...
Qualcomm will continue to fabricate its next-generation 5G mobile chip, tentatively dubbed Snapdragon 895, at Samsung Electronics built using an upgraded 5nm process, but may switch...
Nvidia and Qualcomm reportedly have already reached agreements with TSMC for capacity support from its next-generation manufacturing processes, and with orders from Intel, Apple and...
Qualcomm has rolled out its new Snapdragon 870 series to further enhance its 5G smartphone chip lineup. The new 5G chip is built using TSMC's 7nm process technology.
ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Qualcomm has introduced its latest flagship Snapdragon 888 5G mobile platform, which it says features innovations in 5G, artificial intelligence (AI), gaming, and camera technologies...
Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
