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Tuesday 5 July 2022
IC design houses brace for weak 3Q22
IC design houses are bracing for a particularly weak third-quarter 2022 while also having difficulty negotiating lower foundry quotes, according to industry sources in Taiwan.
Friday 1 July 2022
Xiaomi may renew mobile SoC development via new IC design JV
Chinese handset vendor Xiaomi recently has deepened its in-house chip development by investing in a new semiconductor company, sparking market speculation that Xiaomi may renew development...
Tuesday 28 June 2022
IC test interface vendors eyeing new chip solutions as growth engine
Despite lingering handset sales uncertainty, mobile SoC vendors MediaTek and Qualcomm continue to roll out new high-end offerings, while Apple remains keen on developing high-performance...
Tuesday 28 June 2022
MediaTek remains confident in flagship AP shipments in 2H22
MediaTek is gearing up for a pick-up in high-end smartphone sales during the second half of this year with its recently launched 4nm Dimensity 9000+ series SoC, according to industry...
Monday 27 June 2022
Competition poised to heat up in 3-horse race for 3/2nm processes
Foundry market competitions among TSMC, Samsung Electronics and Intel will heat up significantly as they are advancing to 3/2nm manufacturing nodes, and it seems that Samsung will...
Thursday 23 June 2022
MediaTek expands flagship smartphone SoC with Dimensity 9000+
MediaTek has announced the Dimensity 9000+, an enhancement to the company's top-of-the-line 5G smartphone chipset.
Friday 17 June 2022
TSMC debuts N2 process utilizing nanosheet transistors
TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...
Wednesday 15 June 2022
Qualcomm, MediaTek decelerate further orders with suppliers
With China-based smartphone vendors cutting further their sales goals for 2022, Qualcomm and MediaTek continue decelerating chip orders with their suppliers, according to industry...
Tuesday 7 June 2022
China smartphone SoC shipments fall
Only 17.6 million smartphone SoC solutions were shipped for models rolled out in China in April 2022, down 21.6% on month and 12.1% on year, according to data compiled by CINNO Res...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Tuesday 31 May 2022
Chipmakers see no cutback in orders for datacenters
TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms' and Google's potential capex cuts,...
Friday 27 May 2022
Vivo intros MediaTek-powered Vivo X80 in Taiwan
Vivo has introduced its new flagship smartphone, the Vivo X80, in the Taiwan market, targeting the high-end segment with a price tag of NT$27,990 (US$952).
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Wednesday 18 May 2022
New Qualcomm flagship mobile AP to increase competition for MediaTek
Qualcomm will soon roll out an enhanced version of its Snapdragon 8 Gen 1 mobile SoC built using TSMC's 4nm process technology, according to industry sources. Many are wondering if...
Wednesday 11 May 2022
Taiwan III-V IC makers deliver samples for Wi-Fi 7 RF FEM
Taiwan-based gallium arsenide (GaAs) foundries and epi-wafer suppliers have started delivering epi-wafer samples, which are used in power amplifiers (PA) for Wi-Fi 7 radio-frequency...