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NEWS TAGGED SPIL
Friday 3 December 2021
ASE obtains major orders for new Qualcomm mobile SoC
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...
Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Monday 22 November 2021
Major US chipmakers gearing up for 6nm Wi-Fi 7 SoCs
Leading Wi-Fi chipmakers Qualcomm, Broadcom and even Intel are keenly developing Wi-Fi 7 SoCs, and may have their chips manufactured at TSMC using 6N RF process, looking to meet the...
Thursday 18 November 2021
Qualcomm to scale down modem chip supply for iPhones
Qualcomm will sharply cut back its modem chip supply for Apple's iPhones starting 2023, sparking speculation that Apple will have its in-house developed modem solution ready for the...
Monday 27 September 2021
OSATs in Suzhou concerned more about labor shortage than power reduction
Taiwan's OSATs have seen their plants in Suzhou, Jiangsu province little affected by a power supply cut enforced by China under its carbon reduction policy, but they are more concerned...
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Monday 12 July 2021
ASE Technology to score big in 3Q21 from serving heavyweights
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Friday 28 May 2021
Chipmakers striving to obtain stable aQFN leadframe supply
Chipmakers including MediaTek, Qualcomm and Realtek Semiconductor are striving to secure stable supply of leadframes for use in aQFN packaging, with related leadframe suppliers already...
Friday 21 May 2021
Backend houses gearing up for new orders from Qualcomm
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...
Thursday 20 May 2021
SPIL building new plant at CTSP as main high-end backend base
Siliconware Precision Industries (SPIL) is building a new plant at the Central Taiwan Science Park (CTSP), which will become its main high-end packaging and testing base for the next...
Thursday 6 May 2021
Suppliers to gear up for PS5 redesign
Suppliers including foundry TSMC are expected to kick off production for the redesign of Sony's PlayStation 5 (PS5) games console between the second and third quarters of 2022, according...
Monday 3 May 2021
Booming sales of AMD HPC chips to benefit IC distributors, testing firms
Some Taiwan-based IC distributors and testing service vendors in AMD's supply chain are benefiting significantly from robust sales of the US firm's HPC (high-performance computing)...
Friday 23 April 2021
ASE lands FC-AiP orders for new iPad Pro
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...