Silicon Labs, a US-based wireless SoC and MCU provider, continues to work closely with its Taiwan-based foundry and OSAT partners to improve its delivery lead times, according to...
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Taiwan-based OSATs including ASE Technology have said their local manufacturing operations in Suzhou remain normal despite the city entering a COVID-induced semi-lockdown, but they...
Powertech Technology (PTI) has obtained orders for packaging MediaTek's smartphone application processors slated for launch later in 2022, under the chipmaker's strategy to diversify...
MediaTek will continue to penetrate its 4G and 5G handset APs into Samsung Electronics midrange smartphone models in 2022, allowing its backend partners in Taiwan to benefit and indirectly...
TV SoC and large-size display driver IC (DDI) packaging demand will have a chance to rebound in the second half of 2022, as the FIFA World Cup 2022 slated for November 21-December...
ASE Technology, which owns Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is in preliminary talks with Apple for backend orders associated with...
AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...
Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...
ASE Technology and other Taiwan-based OSATs are gearing up for MediaTek's 5G mmWave chips solutions slated for launch in 2022, according to industry sources.
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Leading Wi-Fi chipmakers Qualcomm, Broadcom and even Intel are keenly developing Wi-Fi 7 SoCs, and may have their chips manufactured at TSMC using 6N RF process, looking to meet the...
Qualcomm will sharply cut back its modem chip supply for Apple's iPhones starting 2023, sparking speculation that Apple will have its in-house developed modem solution ready for the...
Taiwan's OSATs have seen their plants in Suzhou, Jiangsu province little affected by a power supply cut enforced by China under its carbon reduction policy, but they are more concerned...
