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NEWS TAGGED SPIL
Wednesday 3 March 2021
BGA packaging for memory controller ICs hits snag on ABF substrate shortages
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Monday 22 February 2021
Qualcomm gearing up to cement capacity support from Taiwan partners
Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...
Friday 29 January 2021
Backend partners see clear order visibility for AMD chips till 3Q21
Backend houses including Taiwan's ASE Technology and China's Tongfu Microelectronics have seen the visibility of orders for packaging AMD's processors extended to mid third-quarter...
Thursday 28 January 2021
Backend firms upbeat about demand for MediaTek chips
Backend houses in the supply chain of MediaTek have expressed optimism about demand for the fabless client's 5G, Wi-Fi 6 and automotive chip solutions in 2021, and are ramping up...
Tuesday 19 January 2021
ASE Technology posts record profit for 2020
Backend house ASE Technology has reported net profit of NT$27.59 billion (US$985.37 million) on consolidated revenue of NT$476.98 billion for 2020, with both results hitting the highest...
Thursday 3 December 2020
ASE obtains FC packaging orders for new Qualcomm 5G SoC
ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Monday 30 November 2020
Bough Lin to resign as SPIL chairman
Bough Lin will resign as chairman of Siliconware Precision Industries (SPIL), according to ASE Technology, the parent company for SPIL.
Wednesday 25 November 2020
Taiwan backend supply chain poised to embrace 5G AiP segment
5G mmWave AiP (antenna in package) modules are on track to gain increasing penetration in handsets and other devices after being incorporated into iPhone 12 series, and FC-AiP technology...
Monday 23 November 2020
ASE Technology to raise backend service quotes by 5-10% in 1Q21
Taiwan's top OSAT firm ASE Technology will hike backend service quotes by 5-10% starting first-quarter 2021 to reflect increased cost and tight capacity supply for some products,...
Friday 6 November 2020
ASE, Win Semi cut into supply chain for new Qualcomm chips
Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
Monday 19 October 2020
Taiwan IC backend service firms ramping wire bonding capacity
The current tight wire bonding (WB) packaging capacity at Taiwan's IC backend service firms is likely to last beyond the first quarter of 2020 thanks to strong demand from analog...
Wednesday 14 October 2020
LCD driver IC, MOSFET prices to rise over 10% in 4Q20
LCD driver IC and MOSFET chip prices are set to rise over 10% in fourth-quarter 2020 and will continue their rally in the following two quarters to reflect tight supply and rising...
Tuesday 6 October 2020
SPIL sells China subsidiary on Huawei woes
ASE Technology Holding has announced that Siliconware Electronics (Fujian), a wholly-owned subsidiary in China of its member firm Siliconware Precision Industries (SPIL), has been...
Monday 5 October 2020
5G, mini LED opportunities in 2021: Q&A with K&S executive VP CP Chong
For the world, 2020 has been a roller-coaster year, but that has not dampend the prospects of some new tech applications such as mini LED backlighting which are expected to begin...
Tuesday 15 September 2020
TSMC, Samsung scaling up competition in advanced chips packaging
TSMC and Samsung Electronics have seen their competition significantly heat up in advanced packaging technologies beyond foundry processes, which could eventually dent business opportunities...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research