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NEWS TAGGED SUMITOMO
Wednesday 2 October 2024
Sumitomo Metal Mining to mass produce 8-inch SiC wafers
Sumitomo Metal Mining has unveiled plans to significantly increase its production of SiC wafers. The company's subsidiary, Sicoxs, will establish a new production line in Japan to...
Wednesday 25 September 2024
Kioxia secures US$841 million loan to boost latest NAND production for AI and data centers
Kioxia, a leading player in the NAND flash industry, has secured a loan commitment of JPY120 billion (US$841 million) from major financial institutions. This financing will enable...
Wednesday 28 August 2024
Rapidus pursues US$690 million loan to achieve 2nm chip production by 2027
Rapidus, aiming to begin mass production of 2-nanometer chips in Japan by 2027, is seeking significant financial support for its trial production and eventual mass production.
Friday 28 July 2023
Sumitomo Electric to expand 6-inch SiC wafer capacity for EVs
Japan-based Sumitomo Electric Industries is planning to construct a new factory in Japan for the production of silicon carbide (SiC) wafers. Additionally, they will introduce a new...
Wednesday 12 July 2023
Impacts of China's gallium export control on the supply chain
The Chinese government has recently announced without prior warning that it will control exports of gallium and germanium metals. The announcement has received extensive media coverage,...
Monday 17 April 2023
Japan keen on building chiplet technology and ecosystem
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...
Monday 1 August 2022
Sumitomo Metal Mining to build 8-inch SiC substrate prototype line
Japan's Sumitomo Metal Mining (SMM) has decided to construct a new 8-inch direct bonded SiC wafer substrate mass-production prototype line, which will be completed for March 2024...
Friday 24 December 2021
Molding compounds to see worst crunch among packaging materials in 2022
Taiwan-based OSATs will experience mixed supply of packaging materials, with molding compounds to see the worst crunch beyond ABF substrates, and wirebonding leadframes and DAF (die...
Wednesday 24 November 2021
Leadframe supplier CWTC optimistic about demand from OSATs in 2022
Leadframe supplier Chang Wah Technology (CWTC) remains optimistic about demand from the IC backend sector in 2022, despite market concerns about recent corrections in OSATs' capacity...
Monday 31 May 2021
Epoxy molding compound supply now 20% short of demand
The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources.
Friday 28 May 2021
Chipmakers striving to obtain stable aQFN leadframe supply
Chipmakers including MediaTek, Qualcomm and Realtek Semiconductor are striving to secure stable supply of leadframes for use in aQFN packaging, with related leadframe suppliers already...
Tuesday 4 May 2021
OSATs face increasingly tight supply of packaging materials
OSATs have been notified by their Japan-based packaging materials suppliers including Showa Denko about a potential supply shortfall of as much as 50% between May and June, according...
Wednesday 6 May 2020
Chang Wah to expand high-end leadframe production in Taiwan
Lead frame specialist Chang Wah Technology will retain high-end manufacturing operations in Taiwan by incorporating advanced equipment and patented solutions from Japan's Ohkuchi...
Wednesday 13 November 2019
Sumitomo invests in RAC Electric Vehicles
Japan-based trading firm Sumitomo will invest JPY450 million (US$4.12 million) for a 6.7% stake in Taiwan-based electric bus maker RAC Electric Vehicles via private placement of new...
Thursday 30 May 2019
China overtakes Japan as world No. 2 PCB supplier
Taiwan has been the leader in the global PCB sector in terms of production value and technology development, and China has grown rapidly to unseat Japan as the world's second largest...