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Tuesday 13 June 2023
Lockheed Martin, GF team up for secure supply chain
Lockheed Martin and GlobalFoundries (GF) have announced a strategic collaboration to advance semiconductor manufacturing and innovation in the United States and to enhance the security,...
Monday 12 June 2023
Team Group and Phison stay cautious with 2H23 memory demand
Despite some market observers' optimism about the recovery of the memory market in the second half of 2023, Taiwan-based memory module maker Team Group and NAND controller chip maker...
Thursday 8 June 2023
TPK, HDRE team up for energy storage systems, EV charging piles
Touch module maker TPK has disclosed plans to form a joint venture with HD Renewable Energy (HDRE) to develop and produce energy storage systems and charging piles for electric vehicles...
Tuesday 6 June 2023
Nidec, Renesas team up for e-axle semiconductors
Nidec and Renesas Electronics have agreed to collaborate on the development of semiconductor solutions for a next-generation e-axle (X-in-1 system) that combines an electric vehicle...
Thursday 1 June 2023
FIC, Basemark team up for automotive MR solutions
Taiwan-based First International Computer (FIC) announced it is teaming up with Finland-based supplier of augmented reality (AR) software Basemark to develop automotive mixed reality...
Thursday 1 June 2023
Team Group lands large-volume memory module orders for server applications
Memory module and SSD vendor Team Group reportedly recently landed a large-volume B2B memory module order from an international ODM, according to industry sources.
Monday 29 May 2023
MediaTek, Nvidia team up for connected cars
MediaTek has announced a partnership with Nvidia to deliver a complete range of in-vehicle AI cabin solutions for the next generation of software-defined vehicles.
Wednesday 17 May 2023
Synopsys, TSMC team up to help clients accelerate 2nm chips designs
EDA specialist Synopsys has recently announced its collaboration with TSMC to deliver digital and custom design EDA flows on the foundry's most advanced N2 (2nm) process, aiming to...
Wednesday 10 May 2023
Infineon, Foxconn to team up for EVs
Infineon Technologies and Hon Hai Technology (Foxconn) have signed an agreement to work on silicon carbide (SiC) development for electric vehicles (EV).
Thursday 13 April 2023
Arm, Intel Foundry team up for leading-edge SoC designs
Arm and Intel Foundry Services (IFS) have announced a multigeneration collaboration in which chip designers will be able to build low-power system-on-chips (SoC) using Intel 18A technology...
Tuesday 11 April 2023
Adata, Team Group vary in 2H23 memory market outlook
Adata Technology believes its industry will start stabilizing in the second quarter, while fellow memory module firm Team Group still sees the industry having a difficult year.
Friday 7 April 2023
Wise-integration & Powernet team up to deliver digitally controlled, compact, energy-efficient GaN power supply systems
Wise-integration, a French company specialized in digital control of gallium nitride (GaN) power supplies and GaN ICs, and Powernet, a Korean power supply manufacturer, announced...
Thursday 9 March 2023
Apple reportedly reshuffles mangement team to focus more on India
Apple reportedly reshuffled its management team and promoted a head of its Indian market, making India a separate sales region, a sign of the India's growing importance to Apple,...
Wednesday 1 March 2023
Arctic, Compal team up for 5G small cell infrastructure
Arctic Semiconductor (formerly SiTune) has announced that its groundbreaking RF transceiver, IceWings, is powering Compal Electronics' new universal 5G small cell infrastructure pl...
Thursday 23 February 2023
Mercedes-Benz, Google team up for in-car navigation
Mercedes-Benz and Google have jointly announced a long-term strategic partnership, under which Mercedes-Benz will build its own branded navigation using new in-car data and navigation...