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Wednesday 10 April 2019
Adata, Team Group revenues increase in March
Memory module firms Adata Technology and Team Group have both reported sequential increases in March consolidated revenues of about 11% and 28%, respectively.
Monday 1 April 2019
The road to transformation: Q&A with MSI president and CEO Sheng-chang Chiang
After years of operation in the PC market, Micro-Star International (MSI) has advanced to the next phase with the company's founders passing on management to a team of professional...
Tuesday 26 March 2019
EIH to team up with partners to tap global e-paper medical display market
E Ink Holding (EIH) will team up with its hardware and software partners to tap into the global medical display industry after achieving significant results from promoting its e-paper...
Monday 25 March 2019
Memory module firm Team Group looks to revenue and profit growth in 2019
Taiwan-based memory module maker Team Group will be aggressively expanding sales of its high-margin gaming and industrial products to enhance further its profitability in 2019, according...
Friday 22 March 2019
Spirox, ShibaSoku team up
Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with Japan's ShibaSoku under which Spirox will sell ShibaSoku's semiconductor test...
Friday 15 March 2019
Qualcomm, USI and Asustek team up in Brazil
Qualcomm, Universal Scientific Industrial (Shanghai) and Asustek Computer have announced jointly the commercial launch of new Asustek smartphones that utilize Qualcomm's cellular...
Friday 22 February 2019
PCBECI equipment networking pilot team formed in Taiwan
A PCBECI equipment networking pilot team, organized by Taiwan Printed Circuit Association (TPCA), has kicked off operation seeking to boost network connectivity of Taiwan-made PCB...
Wednesday 9 January 2019
Micron, Qualcomm team up for automotive infotainment
Micron Technology has announced its automotive-grade LPDDR4X memory devices are being adopted for Qualcomm's third-generation Snapdragon automotive cockpit compute systems. The companies...
Monday 3 December 2018
DNP, Winbond team up for eSIM
Dai Nippon Printing (DNP) has announced it is teaming up with Winbond Electronics to develop eSIM and other secure elements for IoT devices.
Friday 23 November 2018
Qualcomm expands R&D team in Taiwan
Qualcomm has been expanding its local R&D team in Taiwan to bring the company closer to its Taiwan-based partners such as TSMC for the development of 5G mobile chips, according...
Friday 16 November 2018
Tsinghua and Longsys team up for NAND flash
Tsinghua Unigroup has signed a strategic alliance with memory module firm Shenzhen Longsys Electronics in a move to accelerate its ambition in the NAND flash sector.
Friday 9 November 2018
Jorjin Technologies of the TW 5G Alliance - CHT pilot team to showcase AR/MR smart glasses at NGMN IC&E 2018
Jorjin Technologies, as a member of the TW 5G Alliance - CHT pilot team, will participate in NGMN IC&E 2018 Vancouver this year, to share our results and advances in smart glass...
Monday 29 October 2018
Himax, Kneron team up for AI-enabled security solution
Himax Technologies and Kneron, an artificial intelligence (AI) startup company, have jointly announced a collaboration to accelerate the development and commercialization of a high...
Friday 19 October 2018
Team Group to debut on TWSE as early as year-end 2018
Memory module maker Team Group expects to start trading its shares on the main board of the Taiwan Stock Exchange (TWSE) as early as the end of 2018.
Wednesday 12 September 2018
Memory module firm Team Group applies for TWSE listing
Taiwan-based memory module maker Team Group has applied to be listed on the Taiwan Stock Exchange (TWSE).