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Friday 17 August 2012
BOE eyes team up with Formosa Epitaxy, Unity Opto to set up LED epitaxial wafer plant
China-based LED firms have been producing low-priced LED chips causing oversupply in the upstream LED chip segment to continue. China-based panel maker BOE recently announced plans...
Thursday 2 August 2012
Foxconn refutes rumors about entering Taiwan cable TV channel market
Foxconn Electronics (Hon Hai Precision Industry), commenting on a recent rumor that the company is preparing to enter Taiwan's cable TV channel market, has said it is aiming to work...
Wednesday 1 August 2012
Fujitsu, DoCoMo and NEC team up for communications IC
Fujitsu has announced that the company has reached an agreement with NTT DoCoMo and NEC to form a joint venture, which will focus on the development and sales of semiconductors used...
Tuesday 24 July 2012
ARM, TSMC team up to deliver ARM cores on FinFET transistors
TSMC and ARM have announced a multi-year agreement extending their collaboration beyond 20nm technology to deliver ARM processors on FinFET transistors, enabling the fabless industry...
Monday 2 July 2012
UMC signs license deal with IBM to develop 20nm chips
United Microelectronics (UMC) announced recently that the company has signed a license agreement with IBM to expedite the development of its 20nm CMOS process with FinFET 3D transi...
Tuesday 26 June 2012
ECS passes 2011 finance report with growth of more than 7%
Elitegroup Computer Systems (ECS) hosted a shareholder meeting on June 25, passing its finance report for 2011 with consolidated revenues reaching NT$72.7 billion (US$2.43 billion),...
Friday 15 June 2012
Taiwan market: Yahoo! Kimo expanding marketing team for keyword search advertising
Yahoo! Kimo (Yahoo! Taiwan) has expanded its agent workforce for marketing its online keyword search advertising service in the Taiwan market to 38 sales partners and about 300 sales...
Thursday 7 June 2012
TI and Clientron team up to develop the DM8148 applications processor-based Thin Client Reference Design
Clientron Corp., a world-leading supplier of thin client and embedded systems, in collaboration with Texas Instruments Incorporated (TI), debuts it first TI SoC (System-on-Chip) based...
Wednesday 6 June 2012
Singapore IME, UMC team up to develop TSV for BSI sensors
Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon...
Tuesday 3 April 2012
Spansion, SK Hynix team up for SLC NAND
Spansion has announced an alliance with SK Hynix to introduce SLC NAND products at the 4x, 3x, and 2x nodes. As part of the relationship, the pair will enter into a patent cross-licensing...
Monday 9 January 2012
Arakawa Chemical, Taimide team up on thin-film metallization process research
Taiwan-based polyimide (PI) film supplier Taimide Technology has announced it will work with Japan's Arakawa Chemical Industries to develop a new process used for the manufacture...
Friday 21 October 2011
Fujitsu Semiconductor, Sequans team up for LTE
Sequans Communications announced on October 20 it has established a technology and marketing collaboration with Fujitsu Semiconductor for the purpose of providing customers with a...
Thursday 13 October 2011
Asustek launches Zenbook series ultrabooks
Asustek Computer has unveiled its Zenbook series ultrabooks saying it is confident it has the closest performance/price ratio compared to Apple's MacBook Air.
Thursday 6 October 2011
TSMC to visit Apple for more talks
Taiwan Semiconductor Manufacturing Company (TSMC) has sent a 60-member team, which includes staff from its IC design service partner Global UniChip, to Silicon Valley-based Apple...
Wednesday 28 September 2011
Lantiq, Altair Semiconductor team up for LTE-ready home gateways
Lantiq and Altair Semiconductor have announced that Altair's LTE chipset will be used for the Lantiq XWAY GRX family of network processors, speeding development of LTE-ready home...