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Thursday 27 February 2025
5G-A ignites IoT evolution: RedCap, NTN take center stage at MWC 2025
With 3GPP Release 18 (R18) finalized in late 2024, the 5G-Advanced (5G-A) era officially begins. MWC 2025 will be the key showcase for the latest 5G-A innovations, highlighting its...
Thursday 27 February 2025
Meet Renrong Yu: the quiet billionaire behind China's semiconductor rise
Recently, China's State Council organized a private enterprise forum, convening leading figures from various high-tech industries, including internet services, robotics, electric...
Thursday 27 February 2025
Taiwan and the Netherlands deepen SiPh collaboration to promote PIC industry development
Taiwan and the Netherlands have maintained a close long-term partnership in the semiconductor industry. To accelerate the development of silicon photonics (SiPh) technology, the International...
Wednesday 26 February 2025
Trump administration pressures TSMC to partner with Intel in bid for stronger US ties
The Trump administration has reportedly urged TSMC to partner with Intel and expedite its investments in the US. Sources suggest that TSMC is weighing a controlling stake in Intel's...
Wednesday 26 February 2025
MediaTek debuts 5G-advanced M90 modem at MWC 2025 with AI, satellite integration
MediaTek will unveil its 5G-Advanced M90 modem at MWC 2025 Barcelona, offering peak download speeds of up to 12Gbps. Built on 3GPP Release 17 and Release 18 standards, the M90 also...
Wednesday 26 February 2025
WNC to unveil cutting-edge 5G, AI-powered connectivity solutions at MWC 2025 Barcelona
Wistron NeWeb Corporation (WNC) will showcase its latest communication and connectivity innovations at MWC 2025 Barcelona, highlighting 5G, AI-driven solutions, and next-generation...
Wednesday 26 February 2025
Micron begins shipping samples of 1γ DRAM using EUV
According to the official press release Micron Technology announced the shipment of samples of its 1γ, sixth-generation (10nm-class) DRAM-based DDR5 memory to ecosystem partners...
Wednesday 26 February 2025
Tesla rolls out autopilot in China, edging closer to FSD approval
Tesla has begun rolling out a software update in China, introducing Autopilot driver-assistance features similar to the Full Self-Driving (FSD) system in the US—without explicitly...
Wednesday 26 February 2025
YMTC's hybrid bonding patents: is Samsung losing ground in 400+ layer 3D NAND?
South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND...
Wednesday 26 February 2025
Hidden visionary behind China's CMOS image sensor revolution
Fueled by the surging demand for CMOS Image Sensor (CIS) components in intelligent driving systems and consumer electronics, Will Semiconductor (WillSemi), the company behind OmniVision,...
Wednesday 26 February 2025
Nvidia, Cisco extend partnership aimed at speeding AI adoption
Nvidia, the top provider of chips used in new artificial intelligence computers, is extending a partnership with networking gear maker Cisco Systems in a push aimed at making it easier...
Wednesday 26 February 2025
Apple's US$500 billion US investment plan sparks debate over its strategic implications
Apple's announcement of a US$500 billion investment in the US over the next four years could reshape its manufacturing landscape, yet raises questions about its implications. With...
Wednesday 26 February 2025
Macronix, TSRI announce new 3D DRAM technology
The Taiwan Semiconductor Research Institute (TSRI), under the National Science and Technology Council (NSTC), announced at a press conference held by Taiwan's National Applied Research...
Wednesday 26 February 2025
Realtek unveils world's first USB4 hub controller chip, set for mass production in 1Q25
Realtek has unveiled the world's first fully certified USB4 hub controller chip with integrated USB Type-C/Power Delivery functionality, recognized by the USB-IF.
Wednesday 26 February 2025
Samsung signs licensing agreement with YMTC for Hybrid Bonding tech
Samsung Electronics has reportedly signed a patent licensing agreement with Chinese NAND Flash manufacturer Yangtze Memory Technology Corp (YMTC) to license its Hybrid Bonding technology...