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Friday 1 November 2024
Intel CEO to visit TSMC in November, say sources
Intel CEO Pat Gelsinger will visit TSMC in Taiwan in November, according to industry sources, who also believe that recent media claims about TSMC withdrawing the Intel discount are...
Thursday 31 October 2024
Could South Korea's interests be behind US potential sanctions targeting Chinese display firms?
John Moolenaar, Chairman of the House Select Committee on the Strategic Competition Between the US and China, has recently written to Defense Secretary Lloyd Austin regarding China's...
Thursday 31 October 2024
Tesla FSD technology advances but faces challenges
Tesla's latest announcement regarding its self-driving taxi (Robotaxi) has attracted worldwide interest, indicating a significant advancement in its Full Self-Driving (FSD) technology...
Thursday 31 October 2024
Ennostar leverages Micro LED for AI optical communication and short-range transmission
Micro LED technology is emerging as a promising solution for high-speed AI data transmission and SiPh-based optical communication. Dr. David Su, Chief Strategy Officer of Ennostar,...
Thursday 31 October 2024
GF aims to revitalize foundry business in China with team expansion planned for 2025
GlobalFoundries (GF) is looking to revitalize its operations in China. K.C. Ang, who became GF's president for Asia and chairman for China earlier this year, recently said at an annual...
Thursday 31 October 2024
Technology behind cryptocurrency casino bonuses: technical analysis of blockchain gaming
Blockchain technology has fundamentally transformed how digital transactions and smart contracts operate across multiple industries. While initially known for cryptocurrencies, blockchain's...
Thursday 31 October 2024
DuPont and Zhen Ding form strategic partnership to develop high-end PCB technology
DuPont and Zhen Ding Technology have announced the establishment of a strategic cooperation agreement in the field of advanced PCB technology. Charles Shen, chairman of Zhen Ding,...
Thursday 31 October 2024
Samsung, SK Hynix, Intel put packaging at the heart of future innovation
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Thursday 31 October 2024
UMC sees falling fab utilization and gross margin in 4Q24
Pure-play foundry United Microelectronics (UMC) anticipates a decline in both its fab utilization rate and gross margin in the fourth quarter of 2024, and has lowered its capital...
Wednesday 30 October 2024
China pushing domestically developed AI chips and deployment of RISC-V structure, says DIGITIMES Research
DIGITIMES Research observes that China is rapidly advancing in the field of LLMs. Major technology giants such as Baidu, Alibaba, and Tencent have launched their self-developed LLMs...
Wednesday 30 October 2024
Infineon unveils ultra-thin 20-micrometer power semiconductor wafer
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer...
Wednesday 30 October 2024
Samsung set to introduce high-NA EUV equipment by early 2025
Samsung Electronics is reportedly preparing to introduce its first High-NA EUV (extreme ultraviolet lithography) equipment in early 2025, signaling a major advancement for the South...
Wednesday 30 October 2024
Chinese EV makers rush EU shipments ahead of 35% tariff initiation
Chinese electric vehicle manufacturers are accelerating their European shipments ahead of potential anti-subsidy tariffs of up to 35% that could take effect from November 1. While...
Wednesday 30 October 2024
Samsung enters the SiPh race with I-Cube So/Eo, challenging TSMC and China's rising stars
Samsung Electronics and TSMC are ramping up the development of SiPh technology to handle the exponential data growth driven by AI applications. The Seoul Economic Daily reports...
Wednesday 30 October 2024
Glass substrates poised to transform advanced packaging: Q&A with Corning commercial technology director Xavier Lafosse
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping,...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research