CONNECT WITH US
NEWS TAGGED TECHNOLOGY
Wednesday 24 July 2024
Will glass substrate packaging dominate?
Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips.
Wednesday 24 July 2024
TSMC said to adopt larger glass substrates for FOPLP
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
Tuesday 23 July 2024
ASML looks to expand staff in Japan thanks to rising local EUV demand
As Japan prepares to import its first-ever EUV lithography systems, ASML, the sole technology provider, plans to boost its local workforce significantly.
Tuesday 23 July 2024
TSMC stands firm amid high costs and Trump's criticism, global chip mass production on target
Despite high costs and labor shortages, TSMC has adhered to its international plans to build wafer fabrication plants in Japan, the United States, and Germany.
Tuesday 23 July 2024
Experts call for more support from South Korean government to fend off OLED panel competition from China
Although still leading in OLED panel production globally, South Korea now faces a fierce challenge from China's rapidly advancing display panel industry and this shift has sent shockwaves...
Tuesday 23 July 2024
TSMC outpaces Samsung in HPC revenue growth for 2Q24
TSMC's high-performance computing (HPC) revenue share continued to rise in Q2 2024, boosting overall performance. Although Samsung Electronics aims to increase its HPC sales proportion,...
Tuesday 23 July 2024
Getac demonstrates AI capabilities with new rugged laptops and smart audio-visual solutions
For enterprises whose operations span a diverse range of outdoor working environments, rugged IT solutions that combine purpose-built hardware with industry-specific software can...
Monday 22 July 2024
Taiwan prioritizes drones and AI in new defense technology unit
Taiwan has established a new Defense Innovation Unit (DIU) to accelerate the integration of drones and Artificial Intelligence (AI) systems into its military strategy. This unit,...
Monday 22 July 2024
FOPLP under advanced packaging spotlight after CoWoS
Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing...
Monday 22 July 2024
China-based startup Byinka to ship 7th-gen IGBT to customers
China-based power semiconductor provider Byinka has announced the shipment of its 7th-generation Insulated Gate Bipolar Transistor (IGBT) to leading companies across industries such...
Friday 19 July 2024
Micron sampling MRDIMMs for AI and HPC
Micron Technology has disclosed that it is currently conducting sampling of its Multiplexed Rank Dual Inline Memory Modules (MRDIMM) for memory-intensive applications, including AI...
Friday 19 July 2024
GenAI's staying power: Private AI and smaller models preferred by enterprises
Despite occasional warnings from institutions about a potential GenAI bubble, a new survey reveals that this emerging technology is here to stay.
Friday 19 July 2024
MediaTek seeks to advance smart car, EV ecosystems with AI
MediaTek, a leader in consumer electronics and communications, is looking to establish itself as a key player in the smart car and Electric Vehicle (EV) ecosystem while deepening...
Friday 19 July 2024
Samsung memory goes full throttle, advances 3D and LLW DRAM
As the AI era unfolds, the demand for memory solutions that maximize performance while minimizing power consumption is growing exponentially. Samsung Electronics is reportedly developing...
Friday 19 July 2024
Acer explores hydrogen power to boost ESG initiatives
Hydrogen energy, lauded for its superior thermal properties and negligible carbon emissions, is garnering attention from governments, corporations, and investors as a pivotal component...
CPC
Summary of Tech Supply Chain News!
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research
Competitive color technologies expand e-paper market potential, moving beyond zero-sum game, says DIGITIMES Research