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Wednesday 10 July 2024
Surging TSMC 2nm demand to spark chip investment race in 2025
According to Bloomberg citing UBS forecasts, Taiwan Semiconductor Manufacturing Company (TSMC) could spend up to US$37 billion in capex in 2025, marking a 15.6%...
Tuesday 9 July 2024
Resonac forms alliance developing advanced packaging in US
A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...
Tuesday 9 July 2024
Samsung to make 2nm chips for Japan AI firm
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
Tuesday 9 July 2024
Samsung develops FOWLP-HPB packaging solution to curb mobile AP overheating
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
Tuesday 9 July 2024
Giantplus starts production of flexible OTFTs, marking a breakthrough in the field
The world's first consumer electronic product using organic thin-film transistor (OTFT) technology, the Ledger STAX, has begun shipping.
Monday 8 July 2024
AI advances propel bipedal robots: Japan lags as US and China lead breakthroughs
While Japanese manufacturers have long been at the forefront of bipedal humanoid robot development, recent AI breakthroughs from the US and China's IT industry have propelled these...
Monday 8 July 2024
How bitcoin and blockchain impact gambling industry in Asia
The Asian continent has long been a hub for gambling activities, with various forms of traditional and modern gaming deeply ingrained in the cultural fabric. Concurrently, the rise...
Monday 8 July 2024
TSMC's CoWoS innovator honored as Academia Sinica Academician in Taiwan
The 34th Academia Sinica academician and honorary academician election recently welcomed 28 new members, including Douglas Yu, Vice President of Pathfinding for System Integration...
Monday 8 July 2024
Innolux's transformation journey: from display panel to advanced semiconductor packaging
Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging...
Monday 8 July 2024
India bets big on hydrogen, lures car makers for pilot deployments
In a push to decarbonize, the Indian government is ramping up policy support for hydrogen-powered commercial vehicles. The National Green Hydrogen Mission aims to promote large-scale...
Monday 8 July 2024
Silizium Circuits achieves milestone with TSMC, plans further semiconductor innovations
Indian semiconductor startup Silizium Circuits is a promising company receiving support from the Taiwan government and stationed at the Tainan site of Taiwan Tech Arena (TTA-South),...
Friday 5 July 2024
Japan, South Korea race to develop GCS for next-gen chip packaging amid Intel push
Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players...
Friday 5 July 2024
Carbon Shuttle: innovating Apple's supply chain with sustainable e-waste recycling solutions
Taiwan startup Carbon Shuttle is betting big on innovative carbon-based materials to transform the recycling of precious metals from electronic waste, a critical component in major...
Friday 5 July 2024
Equipment manufacturers resume discussions on FOPLP with TSMC as the lead
As Apple prepares to launch its first AI smartphone in September, the third quarter is expected to see a surge in stocking demand. This has not only pushed TSMC's market value to...
Thursday 4 July 2024
South Korea strives to boost EDA competitiveness
Lee Jong-ho, Korea's Minister of Science and ICT, reportedly arranged a meeting with semiconductor Electronic Design Automation (EDA) professionals to gain insights into the local...