A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
Semiconductor process technology advancements have enabled extreme miniaturization of electronic devices. Coupled with battery technology breakthroughs and AI algorithm maturity,...
The Japan-based startup founded by former Google researchers, Sakana AI, announced that it has received a total of JPY20 billion (US$138 million) from various investors including...
Despite encountering significant challenges from US export controls and subsequent chip shortages, China continues to make substantial progress in its AI industry. The country is...
The UK continues to further its automotive and other industries while investing heavily in high-tech sectors. Harnessing its extensive academic expertise, the country is making significant...
Intel, the bellwether of the US semiconductor manufacturing revival, has faced one setback after another. Following its stock price plunge and rumors of being removed from the Dow...
Despite ASML being the sole provider of high-NA EUV systems, customer adoption is affected by the high price, as ASML aims to begin mass production of the system by 2026.
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
SEMICON Taiwan 2024 made its grand debut on the 4th. President of SK Hynix, Justin Kim, was invited to Taiwan and gave a keynote speech. He mentioned that to push AI technology towards...
Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the...
PCIM Asia 2024 recently kicked off in Shenzhen, China, gathering a diverse array of international and Chinese firms focused on power semiconductors. The event prominently featured...
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Ahead of the UK Low Carbon Vehicle (LCV) event, Julian Hetherington, Director of the Advanced Propulsion Centre (APC), provided an early preview of the electric and energy-efficient...
South Korean battery equipment business CIS has announced its plan to merge with affiliate SNU Precision. As SFA is the largest shareholder for both companies, other related affiliated...
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
