DTS, HD Radio and FotoNation, each mastering different technologies, merged together in 2017 along with Invensas and Tessera to form Xperi Corporation to deliver innovative total...
Tessera Technologies has announced that its wholly-owned subsidiary Invensas signed a new technology license and development agreement with Advanced Semiconductor Engineering (ASE)...
Advanced Semiconductor Engineering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) announcing that its payment to settle patent disputes with Tessera have been...
Packaging and testing firm Powertech Technology (PTI) has issued a company filing with the Taiwan Stock Exchange (TSE) disclosing it has settled a patent infringement dispute with...
Advanced Semiconductor Engineering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) announcing that the company will pay Tessera a total of US$30 million to...
STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...
Tessera Technologies on November 23 announced that Hynix Semiconductor has exercised the renewal option in its 2005 license agreement to extend the term to May 2017.
Despite receiving a favorable ruling in a US International Trade Commission (ITC) over a patent infringement lawsuit brought by Tessera, memory packaging and testing service provider...
Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...
Nanya Technology on December 30 announced the US International Trade Commission (ITC) has affirmed the company and other DRAM makers that no violation was found in the Investigation...
SAN JOSE, Calif., Oct 04, 2009 - Tessera Technologies, Inc. (Nasdaq:TSRA) has announced its FotoNation FaceRecognition technology, which performs automatic identification of specific...
Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...
Tessera Technologies has announced that Taiwan IC substrate maker Kinsus Interconnect Technology has licensed Tessera's micro-PILR interconnect platform, which reduces semiconductor...
Tessera Technologies has announced today that Advanced Wafer Level Packaging Inc. (AWLP) has licensed its full range of Shellcase image sensor packaging technologies, including its...
Tessera Technologies a provider of transformational technologies that enable innovation in next-generation electronics, announced its new Product Launch Services, which will provide...
