TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced...
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
Tongfu Microelectronics and Tianshui Huatian, two major ATMP/OSAT providers in China, have announced fresh investments in their advanced packaging businesses.
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
China's semiconductor firms in the IC packaging & testing, equipment, foundry, and IC design industries performed much better than their IDM, materials, optoelectronics, and memory...
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
In the three major segments of the semiconductor value chain: design, manufacturing, and packaging/testing, China's weakest link is manufacturing. In the packaging and testing field,...
Former TSMC COO, Chiang Shang-yi, currently the chief strategy officer at Foxconn semiconductors, faced challenges when he returned to China's SMIC in December 2020. He encountered...
China-based OSATs, including Chipmore Technology and Tongfu Microelectronics (TFME), have seen orders from the local display driver IC (DDI) sector ramp up recently, according to...
TSMC, ASE Technology and Tongfu Microelectronics (TFME), as well as test interface specialists WinWay Technology and Chunghwa Precision Test Tech (CHPT) are all gearing up for shipments...
While front-end manufacturing and back-end assembling and testing of NVIDIA's next-generation AI chips are handled by TSMC and Taiwan-based packaging and testing companies, China-based...
Malaysia should strive to attract investors to set up at least one medium-size wafer foundry fab to build a complete semiconductor manufacturing supply chain in the country, not just...
Leading Chinese IC assembly and testing player Tonfgu Microelectronics has revealed its first-quarter 2023 results, seeing a revenue of CNY4.64 billion (US$670 million), up 3.11%...
