According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.

In the afternoon of Tuesday, January 16, news broke that Foxsemicon, a subsidiary of Taiwan's electronics behemoth Foxconn, became the latest victim of the elusive LockBit 3.0 hacking...

Taiwan's Industrial Technology Research Institute (ITRI) has partnered with Taiwan Semiconductor Manufacturing Company (TSMC) to conduct ground-breaking research into the design of...

TSMC's fab capacity utilization rates will increase across the board in the first quarter of 2024, according to sources at semiconductor equipment companies.

A recent report by Semianalysis has questioned Intel's timing for introducing High-NA lithography.

Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, has announced plans to acquire silicon IP company Aragio Solutions through its subsidiary Sheng...

Issues with the trade unions may have played a role in forcing TSMC to push back the schedule for volume production at the Arizona fab to 2025, but there were other factors, according...

Taiwan Semiconductor Manufacturing Company (TSMC) is on schedule to implement its 2-nanometer node with the Gate-All-Around (GAA) technology, according to its supply chain partners,...

These are the most-read DIGITIMES Asia stories in the week of January 8-12:

The South Korean IC design startup Exarion is actively developing sound tracing technology.

As TSMC expands its fabs internationally, others in Taiwan's semiconductor supply chain are also working together to extend their presence to other countries, seeking to support the...

TSMC's goal towards comprehensive digital management for its facilities (fac) and fabs is gathering pace, helping the company better address challenges in overseas expansions, according...

Pure-play foundry TSMC has announced revenue decreased 4.5% year on year to NT$2.16 trillion (US$69.5 billion) in 2023, compared to its previous prediction of a 10% decline in US...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane,...

TSMC continues to expand its CoWoS packaging capacity despite recent market rumors suggesting Nvidia has scaled back its orders with the foundry for 2024, according to industry sou...