Use of vapor chamber cooling modules for smartphones is set to expand significantly in 2020 as Samsung Electronics and Huawei are likely to have all of their 5G phones slated for...
Japan's Furukawa Electric and Taiwan-based Lemtech have teamed up to develop stainless steel-based ultra-thin vapor chamber cooling solutions for smartphones.
The development of 5G networks including infrastructures, edging computers and end-market devices will significantly scale up global demand for heat-sink solutions in 2020 and beyond,...
Taiwan-based cooling modules supplier Chaun-Choung Technology (CCI) has seen shipments for smartphones ramp up since the third quarter of 2019, expecting the revenue ratio for such...
Demand for vapor chambers (VCs) from smartphone vendors will grow exponentially in the next few years to support high heat-sinking performance required for 5G smartphones, according...
Samsung Electronics has taken the lead to adopt 0.35mm vapor chambers (VC) in its newly released Galaxy Note 10 series, which may become mainstream smartphone heat-sinking spec in...
Taiwan's cooling module suppliers are set for robust growth in 2020 and beyond driven by demand for heatpipe- or vapor chamber (VC)-based heat dissipation solutions from the smartphone...
With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...
As China's Ministry of Industry and Information Technology is set to issue 5G licenses in the near future, sources from cooling module makers have pointed out that they have received...
The fabrication of semiconductor devices comprises a sequence of processing steps including etching, lithography, diffusion and thin film. How to ensure all process equipment is in...
Razer is bringing its second gaming smartphone, the Razer Phone 2, into Taiwan, its first market in Asia, with the availability to begin on November 17 at NT$25,990 (US$842).
Cooling module maker Chaun-Choung Technology (CCI) has disclosed that Japan-based Nidec is planning to acquire up to a 48% stake in the company through a tender offer at NT$108 (US$3.50)...
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics have seen demand from the server sector accelerate since the beginning of second-half...
Despite the recent market rumors indicating that Samsung Electronics may stop using heat pipes for its new smartphones in 2018, sources from upstream supply chain players have pointed...
Smartphone vendors have been eager to try out vapor chamber technology to improve heat dissipation efficiency, with Taiwan-based Asustek Computer and China-based ZTE having undertaken...
