Overall vapor chamber (VC) demand for handsets has been a disappointment thus far this year, according to Junichi Nagai, chairman for cooling module firm Nidec Chaun-Choung Technology...

Samsung Electronics reportedly is reconsidering adopting vapor chambers for its new smartphones for 2022, which could benefit cooling solution providers' sales, according to sources...

Cooling module makers have expressed optimism about their operations in the third quarter of 2021, citing strong vapor chamber demand for notebooks and servers.

YCTek, the world biggest micro heat pipe manufacturer, has reached a formal patent license agreement with NeoGene Tech to adopt PWS (Print Wick Structuring) approach and MagicWick-Inside...

Murata Manufacturing and Cooler Master have jointly developed a vapor chamber with thickness of only 200um for electronics devices.

In this 5G era, diverse environments have led communications systems and equipment suppliers to find different development opportunities. Also, as private business network applications...

Vapor chamber (VC) demand for 5G smartphones has been a disappointment thus far in 2021, according to sources at cooling module suppliers.

NeoGene Tech has unveiled a breakthrough technology to fabricate a porous wick structure with thickness at only 10-micron, enabling ultrathin vapor chamber devices in large area with...

Demand for vapor chambers (VC) from smartphone vendors has been disappointing so far in 2020, due to the coronavirus pandemic deterring the launch of high-end models by non-Apple...

As demand for 5G mobile phones increases, the vapor chamber (VC) is emerging to become a key component in 5G smartphone thermal management. Competition is keen among vapor chamber...

Taiwan-based cooling module providers remain optimistic about sales prospects of vapor chamber (VC) products for applications in 5G phones in 2021 although their expectations for...

Vapor chambers are increasingly applied to notebooks beyond handsets to better remove heat, and some brand vendors including HP and Lenovo reportedly will launch in second-half 2020...

Taiwan-based smartphone cooling module specialists are capable of producing vapor chambers with thickness of only 0.3mm and will begin shipping the cooling solutions for smartphones...

Taiwan-based cooling module specialists including Auras Technology expect ASPs for handset-use solutions to drop about 10% in the second half of 2020, due to competition from Chinese...

At the upcoming CES 2020, Intel is planning to announce a new thermal module design that is able to enhance notebooks' heat dissipation by 25-30% with many brands also set to showcase...