CONNECT WITH US
NEWS TAGGED VIA
Thursday 18 April 2013
Companies gearing up for USB 3.0 hub market boom
USB controller chipmakers including ASMedia Technology, Genesys Logic, Realtek Semiconductor, Renesas Electronics, Standard Microsystems Corporation (SMSC), Texas Instruments (TI)...
Monday 15 April 2013
VIA Labs lands new orders for USB 3.0 hub controllers
Taiwan-based VIA Labs has grabbed USB 3.0 hub controller orders for docking stations from Lenovo, with shipments kicking off in the third quarter, according to industry sources. Monthly...
Monday 25 March 2013
Quarter of tablet users to pay bills via their devices by 2017, says Juniper Research
A new report from research firm Juniper Research has found that a growing user acceptance of push mobile banking and a sharp rise in tablet adoption will drive users of transactional...
Monday 4 March 2013
Taiwan market: TV vendors look to offer special deals via cooperation with content providers
Rumors are spreading in Taiwan that local-based TV vendors are looking to clear out their reserves by offering low-priced or even free TVs to consumers upon the consumers' agreement...
Wednesday 27 February 2013
VIA announces Android BSP enabling split-screen multi-touch digital signage display at DSE 2013
VIA Technologies has announced its latest Android board support package (BSP) for the VIA Vantage digital signage line which enables a split-screen multi-touch user experience that...
Thursday 17 January 2013
VIA forms IC joint venture with Shanghai Alliance Investment
VIA Technologies has announced that it has set up an IC design house jointly with Shanghai Alliance Investment Company targeting the growing chip market in China.
Monday 14 January 2013
MediaTek, VIA to compete with Qualcomm, Nvidia for processors used in inexpensive tablets
Taiwan-based vendors Acer and Asustek Computer, in order to minimize production cost, have adopted dual-core processors developed by Taiwan-based MediaTek and China-based WonderMedia...
Tuesday 25 December 2012
VIA Labs obtains USB-IF certification for USB 3.0 hub controllers
USB device controller supplier VIA Labs has received USB-IF (USB Implementers Forum) certification for its VL811 and VL812 USB 3.0 hub controller ICs, according to industry sources...
Thursday 20 December 2012
Agilent invests in Taiwan-based Adlink via private placement
Taiwan-based industrial computing product maker Adlink Technology on December 20 announced that Agilent Technologies, a California-based supplier of electronic measurement instruments...
Monday 17 December 2012
USB 3.0 chipmakers push into USB hub business
As Intel started natively supporting USB 3.0 technology with its Ivy Bridge platform, third-party chipmakers including Renesas Electronics, ASMedia, Etron Technology and VIA Labs...
Monday 10 December 2012
Asustek refutes rumors about adopting ARM platform from VIA
Commenting on a recent market rumor that Asustek Computer considers to adopt entry-level ARM-based platform from WonderMedia, a subsidiary of VIA Technologies, for an US$99 7-inch...
Monday 3 December 2012
VIA Labs to roll out new USB 3.0 flash drive controllers built on 85nm
VIA Labs, a subsidiary of VIA Technologies specializing in USB 3.0 integrated chip controllers, will roll out new solutions for USB flash drives in December. The new VIA VL752-series...
Tuesday 20 November 2012
Digitimes Research: China tablet SoC developers enjoy robust shipment growth in 2012
There has been a surge in demand for tablet-use SoC solutions in the China market thus far in 2012, benefiting local IC design companies such as Allwinner Technology, Rockchip Technology...
Wednesday 14 November 2012
ASMedia to be listed at the end of December
ASMedia Technology, an Asustek Computer subsidiary that focuses on producing USB 3.0 controller chips, is set to be listed on the Taiwan Stock Exchange (TSE) at the end of December,...
Thursday 8 November 2012
Aptina benefiting from product differentiation via CIS chips, says executive
Aptina, which supplies a complete lineup of CMOS image sensors, will benefit from the increasing emphasis on camera functionalities and the image processing capabilities of smartphones...
filusch fiore kommunikations.design GmbH
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research