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NEWS TAGGED VIA
Thursday 4 March 2010
VIA announce new embedded box PC for industrial applications
VIA Technologies has announced the VIA ART-3000, a fanless and rugged embedded box system based on the Em-ITX form factor motherboard, offering a solution for a variety of industrial...
Friday 26 February 2010
FCCL maker Taiflex to take up 68% share in Koatech via stock swaps
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific has announced that it will take up a 68% share in optical protective film maker Koatech Technology through a stock swap...
Monday 22 February 2010
Digital Signage Expo 2010: VIA to demo dual-GPU S3 graphics card
VIA Technologies has announced plans to demonstrate a dual GPU add-in-board, the S3 Graphics Chrome 5400E x2, aimed at multi-display digital signage applications at Digital Signage...
Friday 5 February 2010
VIA sees more than 10% revenues decline in January 2010
VIA Technologies saw January 2010 revenues drop 11.35% sequentially to NT$368 million (US$11.48 million) and remain flat compared to the same period in 2009.
Friday 5 February 2010
HTC chairperson invests in solar cell maker Solartech
Cher Wang, chairperson of Taiwan-based HTC (High Tech Computer) and VIA Technologies, has subscribed to over 50% of 28 million new preferred shares issued by Taiwan-based crystalline...
Thursday 28 January 2010
Worldwide PC processor shipments rise 31.3% on year in 4Q09, says IDC
Worldwide PC processor shipments in the fourth quarter of 2009 rose modestly, compared to the third quarter, but still achieved all-time record levels for a single quarter, according...
Thursday 21 January 2010
VIA launches Mobile-ITX motherboard
VIA Technologies has announced the VIA EPIA-T700, the first motherboard based on the recently announced Mobile-ITX form factor. Measuring 6×6cm, the VIA EPIA-T700 is a compact...
Friday 15 January 2010
VIA debuts USB 2.0-based audio controller
VIA Technologies has unveiled the VIA Vinyl Envy VT1730 audio controller, a highly integrated single chip solution that leverages USB 2.0.
Wednesday 6 January 2010
VIA up, SiS down on month in December revenues
VIA Technology and Silicon Integrated Systems (SiS) have announced mixed results for their revenues in December, 2009.
Tuesday 5 January 2010
VIA launches USB 3.0 hub controller
VIA Technologies has unveiled the VIA VL810 SuperSpeed Hub Controller, the industry's first integrated single chip solution to support the higher transfer rates of the new USB 3.0...
Tuesday 22 December 2009
USB 3.0 controller chip price cut to below US$3, say IC distributors
Taiwan-based IC distributors have expressed concerns about profits from USB 3.0 product lines despite prospects of their strong sales in the market, as quotes of USB 3.0 device controller...
Monday 14 December 2009
VIA announces new digital media chipset for Windows 7
VIA Technologies has announced the VIA VN1000 digital media chipset for next generation desktop and all-in-one PCs, offering a high definition (HD) multimedia entertainment platform...
Friday 4 December 2009
VIA Technologies sees revenues decline in November 2009
VIA Technologies has posted revenues of NT$375.7 million (US$11.65 million) for November 2009, down 12.4% sequentially and 8.9% on year. For the first 11 months of 2009, revenues...
Wednesday 2 December 2009
VIA announces Mobile-ITX form factor to bring further miniaturization
VIA Technologies has announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices.
Tuesday 10 November 2009
Global PC processor shipments jump 23% sequentially in 3Q09, says IDC
Worldwide PC processor shipments in the third quarter of 2009 rose substantially by an all-time record level for a single quarter, according to data from IDC. PC processor unit shipments...
megawin
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research