The output value of Taiwan's compound semiconductor industry grew 26.4% on year to NT$36 billion (US$1.28 billion) in the first half of 2021, according to statistics compiled by the...
SEMICON Taiwan 2021 has announced that starting from September, five online technology forums will be held as a prelude to its physical exhibition, which has been rescheduled to December...
While Apple is expected to have at least its new iPhone Pro series for 2021 feature ToF-based LiDAR scanners, some Android handset vendors including China's Honor are poised to resume...
Power amplifier (PA) demand for 5G smartphones applications remains strong, and that for 5G base stations is picking up with order visibility strengthened, according to sources at...
GaAs IC foundries Win Semiconductors and Advanced Wireless Semiconductor Company (AWSC), and GaAs epi-wafer supplier Visual Photonics Epitaxy Company (VPEC) are all poised to log...
Vendors of third-generation semiconductors including GaN and SiC (silicon carbide) are stepping up regional production and marketing deployments to better explore immense demand for...
Taiwan-based GaAs foundry houses, including Win Semiconductors, Advanced Wireless Semiconductor (AWSC) and Visual Photonics Epitaxy (VPEC), are set to land more orders from Chinese...
China brand vendors such as Xiaomi and Anker have rolled out their GaN-based fast charging devices for consumer technology products, which will be stimulating demand for GaN-on-Si...
GaAs IC foundries Win Semiconductors and Advanced Wireless Semiconductor Company (AWSC), and GaAs epi-wafer supplier Visual Photonics Epitaxy Company (VPEC) are gearing up for a seasonal...
Taiwan's III-V semiconductor players including foundry Win Semiconductors and epi-wafer supplier Visual Photonics Epitaxy (VPEC) have cut into the supply chains of major carmakers...
Taiwan's III-V semiconductor players have seen demand for GaAs-based power amplifiers for smartphone and Wi-Fi 6 applications remain steady despite a slowdown in 5G rollouts, according...
It is still premature to assess the impacts of the recent spike of COVID-19 infections in Taiwan on local III-V semiconductor players, as related makers have initiated precautionary...
Apple reportedly has decided to scale down the die size by 40-50% for VCSEL chips used in 3D face ID sensors for new iPhone and iPad devices to be rolled out later in 2021, a move...
Taiwan has lagged behind world leaders by 20-30 years in the development of third-generation semiconductor materials including silicon carbide (SiC) and must use more collective forces...
Taiwan's 3D sensor, PA and VCM suppliers for iPhones are expected to revive their inventory-preparation momentum for new iPhones starting June following a slowdown in delivering shipments...
