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NEWS TAGGED WINBOND
Thursday 10 June 2021
NOR flash prices to soar in 3Q21
NOR flash prices are expected to rise 20-30% in the third quarter of 2021, as the memory supply becomes extremely tight, according to market sources.
Monday 7 June 2021
Winbond to see profit more than double in 2Q21
Rising specialty DRAM and NOR flash memory prices are set to boost net profits at Winbond Electronics in the second quarter of 2021, which are likely to more than double those generated...
Tuesday 1 June 2021
GigaDevice eyeing bigger share in TWS earbuds market
NOR flash chipmaker GigaDevice is reportedly ramping up its output at Hua Hong Semiconductor, eyeing a bigger share in the TWS earbuds market segment.
Tuesday 18 May 2021
Taiwan tech firms tighten precautionary measures against COVID-19
Taiwan-based high-tech companies in various sectors have all strengthened their precautionary measures, such as operating in segregated teams and work from home (WFH) in response...
Friday 7 May 2021
Winbond posts profit hike in 1Q21
Specialty DRAM and flash chipmaker Winbond Electronics has reported net profits jumped 350% sequentially to NT$1.59 billion (US$56.8 million) in the first quarter, with EPS reaching...
Wednesday 5 May 2021
Rising ASPs to boost Nanya, Winbond 2Q21 revenues
Memory chip makers Nanya Technology and Winbond Electronics will see their revenues boosted by rising ASPs in the second quarter, according to industry sources.
Monday 12 April 2021
VIS reports record 1Q21 revenue
Taiwan-based Vanguard International Semiconductor (VIS), an 8-inch foundry for specialty ICs, saw its first-quarter revenue increase 5.3% sequentially to a record high of NT$9.18...
Thursday 8 April 2021
NOR flash chipmakers see more customers eager for long-term deals
Taiwan-based NOR flash chipmakers have seen more of their clients eager to strike long-term supply agreements, according to industry sources.
Tuesday 6 April 2021
Backend firms to see robust demand for specialty DRAM through 3Q21
Backend houses including Powertech Technology (PTI) and ChipMOS Technologies have seen demand for specialty DRAM chips surge in the last 1-2 months, and are expected to enjoy robust...
Thursday 25 March 2021
Complete new cloud-to-device solution gives proven way to implement secure over-the-air firmware updates in IoT devices
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, microcontroller manufacturer Nuvoton and security software developer Qinglianyun has...
Wednesday 17 March 2021
Winbond board approves capex for new 12-inch fab in southern Taiwan
Winbond Electronics' board of directors has approved a capex budget of approximately NT$13.13 billion (US$463.83 million) to invest in the company's new 12-inch wafer plant located...
Monday 15 March 2021
Memory demand for notebooks still robust
Brand notebook vendors and OEMs continue to step up their pace of chip orders, including those for memory chips and devices, despite overbooking concerns, according to sources at...
Friday 12 March 2021
DRAM probe card demand ramping up
Major memory probe card vendors in the US and Japan have seen a surge in demand from DRAM suppliers, with delivery lead times for their orders already extended to around 20 weeks...
Friday 12 March 2021
DDR3 memory shortage worsens
Global supply of DDR3 chips has fallen short of demand by at least over 30,000 wafers, which has been pushing up pricing for the memory, according to industry sources.
Tuesday 9 March 2021
Winbond, Macronix post brisk February results
Winbond Electronics, a maker of specialty DRAM and flash memory, and ROM and flash memory chipmaker Macronix International both saw their revenues for February 2021 come to high levels...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.