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NEWS TAGGED WIREBOND
Friday 23 July 2021
Wire-bonding quotes to hike again in 1H22 as materials costs surge
OSATs are expected to raise their quotes again for wire-bonding packaging services in the first half of 2022 to reflect ever-rising costs for materials such as leadframes and molding...
Tuesday 20 April 2021
ASE stepping up purchases of automated wire-bonding machines
Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing...
Tuesday 23 February 2021
Foundry, packaging materials in tight supply
The supply of foundry and packaging materials, such as photoresist and leadframes, has already fallen short of demand, prompting related distributors to raise prices, according to...
Tuesday 19 January 2021
Lead times extend for wirebonding packaging equipment
Delivery lead times for wirebonding packaging equipment have extended to over six months, according to industry sources in Taiwan.
Tuesday 20 November 2012
STATS ChipPAC to expand operations in Korea
STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...
Wednesday 12 September 2012
Demand for copper wirebonding machines to slide 50% sequentially in 4Q12
Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...
Monday 3 September 2012
Taiwan copper wirebonding production value to rise
The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.
Wednesday 4 May 2011
STATS ChipPAC reaches milestone of over 300 million copper wirebond units shipped
STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...
Friday 4 March 2011
SPIL sees boost in copper wirebonding orders, says paper
With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...
Thursday 23 September 2010
ASE slowing copper wire bonding expansion, says paper
Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic...
Tuesday 14 September 2010
SPIL enters LED packaging market
Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...
Tuesday 15 June 2010
ASE raises 2010 capex
Advanced Semiconductor Engineering (ASE) has decided to boost its 2010 capex to US$600-700 million from US$450-500 million it earlier planned, said company COO Tien Wu at a recent...
Monday 3 May 2010
ASE expects higher shipments, gross margin in 2Q10
Chip packaging and testing company Advanced Semiconductor Engineering (ASE) expects shipments to grow by 11-13% sequentially in the second quarter of 2010, driven particularly by...
Monday 2 November 2009
ASE, SPIL speeding up copper wire bonding expansion
Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...
Friday 16 October 2009
ASE and SPIL deny headhunting rumors
Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...