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NEWS TAGGED XINTEC
Friday 22 June 2018
Taiwan OSAT firms suffer unclear order visibility for 3Q18
After experiencing lackluster revenue and profit performances in the first half of 2018, Taiwan OSAT (outsourced semiconductor assembly and test) players still see unclear visibility...
Wednesday 20 June 2018
Xintec halts 12-inch wafer-level packaging production
Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...
Monday 4 June 2018
Taiwan 2nd-tier backend firms enjoy pick-up of orders
Taiwan-based second-tier packaging and testing houses have enjoyed a pick-up of orders for flash memory, and 3D sensing and other optical components recently as their downstream clients...
Monday 26 March 2018
Taiwan 3D sensor supply chain to gain more from new iPhones
As Apple has reportedly decided to continue using 3D sensor-based face recognition in its new iPhone devices in 2018, Taiwan suppliers in the 3D sensor supply chain, including those...
Thursday 8 February 2018
Xintec losses widen in 2017
Image sensor packaging specialist Xintec saw its net losses widen to NT$733 million (US$25.1 million) in 2017 from losses of NT$636 million in 2016. EPS stayed negative at NT$2.71.
Tuesday 16 January 2018
Xintec to see orders for 3D sensing from iPhone and Android camps
Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a...
Monday 4 December 2017
Taiwan players in 3D sensor supply chain to see lucrative market in 2018
With Android-based smartphones vendors expected to incorporate 3D sensors into their smartphone models following Apple's adoption of TrueDepth facial recognition system of iPhone...
Tuesday 17 October 2017
Xintec to swing to profit in 4Q17, says report
Image sensor packaging specialist Xintec is expected to return to profitability in the fourth quarter of 2017 with revenues likely to increase around 30% sequentially to nearly NT$1.3...
Friday 25 August 2017
Xintec loss widens in 1H17
Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.
Tuesday 22 August 2017
Qualcomm developing 3D depth sensing technology
Qualcomm is partnering with its ecosystem partners to develop 3D depth sensing technology, which will be applied to Andriod smartphones powered the Snapdragon mobile chips, according...
Thursday 4 May 2017
Xintec reports 7th consecutive quarterly loss in 1Q17
Specialty-IC packaging specialist XinTec has reported a seventh consecutive quarterly loss in the first quarter of 2017, in which net losses came to NT$248 million (US$8.23 million)...
Wednesday 29 March 2017
Xintec looks to turnaround in 2H17
Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...
Saturday 18 February 2017
Xintec swings to loss for 2016
Taiwan-based Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...
Wednesday 31 August 2016
Orders for iris recognition chips to boost Xintec 2017 revenues, says report
Taiwan-based Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...
Monday 14 March 2016
Xintec February revenues rise 30% on month
Taiwan-based Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research