The supply of more lucrative high-end ABF substrates for use in HPC, server and 5G networking chips has been increasingly short of demand due partly to insufficient yield rates at...
Major automotive chip vendors including NXP are mulling adopting FOPLP (fan-out panel level packaging) technology to process part of their peripheral automotive chips seeking to reduce...
Foldable-screen notebooks are estimated to be priced more than NT$70,000 (US$2,469) due to the high components costs, according to sources from the upstream supply chain.
AMD has been promised more 7nm foundry capacity at TSMC, but actual shipments for its PS5 chips will depend on the production yield rates for ABF substrates needed to make the customized...
The worsening shortages of ABF substrates are expected to become one of the major woes affecting shipments of new CPU and GPU products at chipmakers in 2021, according to industry...
Backend houses have seen smooth progress in packaging customized SoCs for Sony's PS5 and yield rates at the foundry partner are also steady, with shipment goal set by the vendor for...
MLCC and chip resistor specialists Yageo and Walsin Technology both enjoyed revenue increases in July 2020, and have seen clear order visibility for the third quarter thanks to continued...
SK Hynix has reported operating profits of KRW1.95 trillion (US$1.62 billion) on consolidated revenue of KRW8.61 trillion for the second quarter of 2020.
Taiwan-based diode maker Eris Technology is expected to gain more business opportunities from display, 5G and ESD (electrostatic discharge) applications in the second half of 2020...
The output value of South Korea's memory chip industry grew about 1% sequentially in the first quarter of 2020, thanks mainly to a ramp-up in demand arising from the stay-at-home...
Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect are gearing up to capture orders for flexible antenna boards for 5G iPhones, especially those...
China's leading PCB makers Shennan Circuits and Wus Printed Circuit are expected to see their net earnings for 2019 double from 2018 on robust demand for high-layer-count (HLC) PCBs...
IC substrate maker Uniflex Technology expects shipments of NFC (near-field communication) flexible board modules and mini LED substrates to expand significantly, boosting overall...
Taiwan-based notebook ODMs have completed most of their plant relocation and their present focus is to improve production yield rates and reduce costs at the relocated facilities...
Backend demand for OLED driver ICs is set to take off in 2020, with COP (chip on plastic) and COF (chip on film) likely to co-exist as main packaging processes, according to industry...
