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Thursday 3 November 2016
Foxconn team creates startup for digital signage products
Foxconn Electronics (Hon Hai Precision Industry) is planning to nurture an internal team to create a new startup to push into the digital signage market. The team recently established...
Tuesday 20 September 2016
BOE reportedly sets up new R&D team for bio-sensors
China-based BOE has teamed up at least 100 engineers engaged in R&D for bio-sensors, according to industry sources. A business unit has also been set up under BOE to focus on...
Tuesday 13 September 2016
Himax, Nuviz team up for HUD products
Taiwan-based fabless IC firm Himax Technologies has announced it is partnering with Nuviz to develop head-up display (HUD) products.
Monday 5 September 2016
UMC, APM team up for MEMS foundry services
Taiwan-based United Microelectronics (UMC) has announced it is teaming up with dedicated MEMS foundry Asia Pacific Microsystems (APM) to provide enhanced MEMS manufacturing services...
Thursday 1 September 2016
Renesas, TSMC team up for 28nm MCUs
Renesas Electronics and TSMC have announced that they are collaborating on 28nm embedded flash (eFlash) process technology for manufacturing microcontrollers (MCUs) targeted at next-generation...
Wednesday 17 August 2016
ARM, Intel team up for 10nm
At the Intel Developer Forum on August 16, Intel announced its 10nm design platform for foundry customers will now offer access to ARM Artisan physical IP, including POP IP, based...
Wednesday 17 August 2016
Micron, Silicon Motion team up for UFS solutions
Micron Technology is working with its controller partner Silicon Motion Technology to develop controller solutions for Universal Flash Storage (UFS) chips, according to industry sources...
Wednesday 8 June 2016
ASRock expects growing performance in 2016
ASRock had an unsatisfactory performance in 2015 due to decreased motherboard shipments in China and increased expenses on server and industrial PC (IPC) investments; however, the...
Wednesday 1 June 2016
Brazil market: Xiaomi recalls handset team, to not introduce new models temporarily
Xiaomi Technology reportedly has recalled its handset team stationed in Brazil back to China due to difficulty promoting smartphones in the country and will not introduce new models...
Monday 18 April 2016
University team develops cloud-based symbiotic system for fish farms and hydroponics
A team consisting of several professors from the Department of Electronic Engineering at the National Taipei University of Technology has developed a symbiotic ecosystem between fish...
Friday 4 March 2016
President-elect vows to safeguard Taiwan semiconductor industry
The Taiwan government must form a "national team" in cooperation with local enterprises to meet increasing challenges amid the rising supply chain from China, president-elect...
Friday 4 March 2016
Smartphone AP suppliers to team up with TSMC to compete with Qualcomm-Samsung in 10nm chip market
Smartphone-use application processor (AP) makers in Taiwan and China are teaming up closely with Taiwan Semiconductor Manufacturing Company (TSMC) to compete with Qualcomm-Samsung...
Monday 4 January 2016
MediaTek expands R&D team within IoT BU
MediaTek has expanded the R&D team within its IoT (Internet of Things) business unit to more than 200 engineers, and the number of its IoT R&D staff will continue to grow...
Wednesday 25 November 2015
PEZY and Imagination team up to develop next-generation HPC systems
Imagination Technologies (IMG.L) and PEZY Computing K.K. announce a strategic partnership focused on development of next-generation efficient high performance computing (HPC) systems...
Thursday 19 November 2015
Asustek assigns new head of R&D team
Asustek Computer has appointed its vice president Joe Hsieh to lead its R&D unit, the Da Vinci Laboratory, to focus on developing technology for Internet of Things (IoT) and Industry...