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Monday 26 August 2013
Huawei to team up with Compal to make smartphones, tablets in Brazil, says paper
Huawei Technologies plans to team up with Taiwan-based Compal Electronics to produce smartphones and tablets in Jundiai, Brazil, according to a Chinese-language Economic Daily...
Thursday 27 June 2013
Synopsys, UMC team up for 14nm FinFET
IC foundry United Microelectronics (UMC) has announced that its partnership with Synopsys, a provider of electronic design automation (EDA) software and services, resulted in the...
Friday 31 May 2013
InnoDisk, Aptos team up for industrial embedded use SSDs
InnoDisk, which specializes in flash storage devices for industrial applications and embedded systems, has teamed up with backend service provider Aptos Technology to develop a new...
Wednesday 29 May 2013
Xilinx, TSMC team up for 16nm FinFET FPGAs
Xilinx and TSMC have jointly announced that they are teaming up to create FPGAs built using 16nm FinFET process technology.
Wednesday 22 May 2013
Imec, Globalfoundries team up for STT-MRAM
Globalfoundries has joined Imec's industrial research collaboration to develop spin-transfer torque magnetoresistive random access memory (STT-MRAM), according to the IC foundry.
Monday 29 April 2013
Infineon, Globalfoundries team on 40nm embedded flash process
Infineon Technologies and Globalfoundries have announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.
Tuesday 16 April 2013
TSMC, Altera team on 55nm embedded flash process
Programmable logic supplier Altera is working with foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) on a 55nm embedded flash (EmbFlash) process technology tailored...
Monday 25 February 2013
Sequans, Alcatel-Lucent team up for LTE broadcast
Sequans Communications has successfully completed interoperability testing of Alcatel-Lucent's LTE infrastructure equipment with Sequan's eBMS-capable LTE chipsets, according to the...
Friday 22 February 2013
Austrian research team develop a new flat, flexible, transparent, and potentially disposable polymer sheet for capturing images
An Austrian research team has developed a new way of capturing images based on a flat, flexible, transparent, and potentially disposable polymer sheet. The team describesd their new...
Wednesday 23 January 2013
Samsung reportedly replaces management team in Brazil market
Korea-based Samsung Electronics has reportedly replaced its management team in Brazil despite the team's efforts helping Samsung to become the largest vendor in the country, defeating...
Thursday 17 January 2013
MStar Semiconductor and Flingo Samba TV platform team up to provide smart TV solution
Smart TV app publisher Flingo has announced that Samba, its new interactive TV platform, will be integrated into MStar Semiconductor Smart TV solution to synchronize TV, tablet, phone...
Tuesday 20 November 2012
UMC restructures executive team
Foundry chipmaker United Microelectronics has announced the appointment of Po-Wen Yen to the position of CEO, effective immediately. Former CEO Shih-Wei Sun has been promoted to company...
Friday 7 September 2012
UMC, STMicro team up to develop BSI process for image sensors
United Microelectronics (UMC) has teamed up with STMicroelectronics to develop 65nm CMOS image sensor technology using backside illumination (BSI).
Thursday 30 August 2012
ALi, Panasonic team up for DVB-T2 chipset
ALi, a provider of set-top box (STB) system-on-chip (SoC) solutions, has announced that the company has teamed up with Panasonic's semiconductor business group to begin mass production...
Friday 17 August 2012
BOE eyes team up with Formosa Epitaxy, Unity Opto to set up LED epitaxial wafer plant
China-based LED firms have been producing low-priced LED chips causing oversupply in the upstream LED chip segment to continue. China-based panel maker BOE recently announced plans...