Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market will only see mild...
Faced with challenging market conditions, system-on-chip (SoC) and private Wi-Fi (pWi-Fi) specialist Mars Semiconductor is streamlining operational expenses to maintain profitability,...
On December 24, 2024, Taiwan-based mobility solutions leader Line Go hosted a media event where Chairman and CEO Lin Chun-sheng detailed the current state of Taiwan's Mobility-as-a-Service...
Samsung Electronics is preparing to unveil its latest products at the Galaxy Unpacked event scheduled for January 2025. This event is set to feature the launch of the flagship Galaxy...
Having previously focused on advanced chips for AI, the US government is now targeting mature process semiconductors amid fears of Chinese dumping that could undermine American suppliers...
Tokyo Electron (TEL) aims to increase its revenue share from AI-related semiconductor equipment to approximately 40% by the fiscal year ending March 2026, up from the current 30%...
MediaTek held a Dimensity product launch event in Beijing, China, on the 23rd, with Xiaomi executives attending as partners and Vivo and Oppo showing support through videos. Xiaomi's...
HD Renewables announced plans on December 23 to establish a green energy investment and asset management platform, "ZEBRE," in partnership with ZEN Energy Group. The venture targets...
The newly elected US President Donald Trump previously announced plans to impose a 25% tariff on products from Mexico. Samsung Electronics operates television and home appliance factories...
While Samsung Electronics has integrated its own Exynos 2400 chip in some models of the Galaxy S24 series, the foldable Galaxy Z Flip6 and Fold6 series are still entirely equipped...
As Broadcom strengthens its position in AI chip development through partnerships with industry giants like Apple and Google, the company has now secured a significant high-bandwidth...
MediaTek has introduced its new Dimensity 8400 SoC series for light flagship smartphones, with Redmi being the first to release a model featuring this processor.
Nan Ya PCB, one of Taiwan's top trio of substrate manufacturers, has capitalized on a strategic opportunity in the latter half of 2024 by launching new high-end substrate products...
Micron has released its first-quarter fiscal 2025 (1QFY25, ending November 28, 2024) financial results, highlighting strong performance in its HBM segment. However, a weaker-than-expected...
Japanese NAND flash maker Kioxia debuted on the Tokyo Stock Exchange's Prime Market on December 18, marking a significant milestone. Despite an initial stock price surge, the company's...
