Governments worldwide are investing billions in AI infrastructure, enhancing domestic technology, protecting national security, and creating demand for developers and chipmakers like...

GlobalFoundries (GF) is optimistic that silicon photonics (SiPh) will become a key growth area for the future data center market. In a recent interview with All About Circuits, Vikas...

AMOLED has overtaken LCD as the mainstream screen technology for mobile phones, heaping pressure on Taiwanese panel makers who specialize in the latter, according to industry sourc...

Apple sent shock waves across the industry in March by canceling its microLED project and ending collaboration with Ams OSRAM.

AI PCs' acceptance by consumers depends on the potential of AI technology, AI chips, and suppliers like assembly providers in the end-user market. In the Japanese market, research...

US-based Rain Technology has accumulated more than two decades of experience in consumer display technologies, with ventures into LCD, OLED, e-privacy, and automotive fields. The...

Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...

In the heart of Berlin, a small startup is poised to disrupt the electronics industry with a material that has been around for decades: carbon fiber. Carbon Mobile, led by CEO Firas...

Samsung Electronics is reportedly adopting Molybdenum (Mo) for the metal wiring process in its ninth-generation 3D NAND (V9 NAND) technology.

The transformation of smart grids has boosted demand for power semiconductors, nurturing Chinese and Taiwanese suppliers to accelerate R&D of relevant product lines such as thyristors,...

According to Bloomberg citing UBS forecasts, Taiwan Semiconductor Manufacturing Company (TSMC) could spend up to US$37 billion in capex in 2025, marking a 15.6%...

A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...

Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...

Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...

The world's first consumer electronic product using organic thin-film transistor (OTFT) technology, the Ledger STAX, has begun shipping.