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Samsung, SK Hynix, Intel put packaging at the heart of future innovation

Daniel Chiang, Taipei; Levi Li, DIGITIMES Asia Thursday 31 October 2024 0

Credit: DIGITIMES

At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and next-gen computing, the companies stressed packaging's role in boosting...

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