CONNECT WITH US

Samsung, SK Hynix, Intel put packaging at the heart of future innovation

Daniel Chiang, Taipei; Levi Li, DIGITIMES Asia 0

Credit: DIGITIMES

At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and next-gen computing, the companies stressed packaging's role in boosting...

The article requires paid subscription. Subscribe Now