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    China silicon wafer makers expand 12-inch capacity and consolidate mature-node operations
    7h 29min ago
    Cambricon and Moore Threads post strong 1H26 growth as China AI chips move to deployment
    7h 29min ago
    Google readies Pixel 11 lineup, market breakthrough still under question
    7h 29min ago
    Interview: Nvidia says networking is the core of AI computing as AI factories scale
    7h 29min ago
    China auto brand slump pushes parts makers toward North America, Japan
    7h 29min ago
    Taiwan producer prices surge as non-China supply chains face rising pressure
    7h 29min ago
    NEWS TAGGED 3D
    Monday 10 August 2026
    SK Hynix faces US patent fight over HBM, 3D NAND

    SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation...

    Friday 7 August 2026
    NEO seeks partner by end-2026 for fivefold-density X-SRAM

    AI memory startup NEO Semiconductor has unveiled X-SRAM, a new architecture designed to address the difficulty of scaling conventional...

    Thursday 6 August 2026
    NEO Semiconductor unveils AI memory platform aimed at easing global bottlenecks
    NEO Semiconductor has launched NEO.AI, a memory platform it says could help address one of the biggest constraints on artificial intelligence (AI) systems worldwide: limited memory...
    Wednesday 5 August 2026
    Kioxia and Sandisk unveil faster, denser QLC flash memory for AI infrastructure
    Kioxia and Sandisk have introduced a next-generation QLC 3D flash memory technology that boosts storage density, bandwidth, and power efficiency, a development that could help global...
    Wednesday 5 August 2026
    Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
    Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...
    Tuesday 4 August 2026
    YMTC rejects patent-loss claims in global 3D NAND clash with Micron
    Yangtze Memory Technologies Corp. (YMTC) has rejected claims that the US Patent and Trademark Office (USPTO) invalidated all 19 claims of a core 3D NAND patent, calling the reports...
    Friday 31 July 2026
    Kioxia begins sampling 1TB 3D flash memory for AI devices
    Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage...
    Wednesday 29 July 2026
    Samsung and SK Hynix hold back on 3D IC; CXMT and Winbond gain
    AI demand is driving a sharp rise in inquiries about 3D IC, but some in South Korea say the new technology is unlikely to become a fresh growth engine for Samsung Electronics and SK...
    Friday 24 July 2026
    SK Hynix seeks US engineers for 3D stacked DRAM push

    SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy...

    Friday 17 July 2026
    China's AI chips hit three walls — and bet on 3D memory to break through
    China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.
    Wednesday 15 July 2026
    PSMC lifts DRAM foundry prices 45% as 3D AI Foundry targets 20% revenue share
    Major cloud service providers (CSPs) have front-loaded purchases of future DRAM capacity, and the global memory supply-demand gap is expected to last through 2027. Powerchip Semiconductor...
    Tuesday 14 July 2026
    AI demand pushes global ABF substrate market into shortage, with pressure seen through 2028

    The AI boom is tightening an important but often overlooked part of the chip supply chain, with global readers likely to feel the effects...

    Tuesday 14 July 2026
    Samsung brings HBM, logic, and optics together in packaging push
    Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
    Friday 10 July 2026
    JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
    JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...
    Monday 6 July 2026
    China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips

    SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang...

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    Research_DB
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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