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    FCC expands non-US network gear ban to mobile hotspots and home CPE
    Apr 28, 19:32
    Vera Rubin rack may consume LPDDR equal to 4,500 smartphones, sparking panic buying
    Apr 28, 19:32
    NEWS TAGGED 3D
    Wednesday 29 April 2026
    Osense develops baseball hawk-eye system to capture US$10 billion sports tech market
    Taiwanese artificial intelligence (AI) software company Osense Technology is targeting the rapidly growing sports technology market — valued at more than US$10 billion —...
    Monday 27 April 2026
    Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
    Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
    Monday 27 April 2026
    NEO Semiconductor advances 3D DRAM with POC validation
    Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years...
    Sunday 26 April 2026
    Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling
    Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix,...
    Wednesday 22 April 2026
    SJSemi's blockbuster IPO reorders China's chip packaging landscape
    Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial...
    Monday 20 April 2026
    Odisha to break ground on India's first advanced 3D chip packaging unit
    Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous...
    Tuesday 14 April 2026
    JCET advances CPO, glass substrates to capture AI packaging demand
    JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
    Thursday 2 April 2026
    Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026
    Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D...
    Monday 30 March 2026
    DRAM scaling hits limits as next-generation memory faces delays

    The global DRAM industry is approaching a structural inflection point, as traditional scaling methods struggle to deliver the performance...

    Sunday 29 March 2026
    SK Hynix and Kioxia targeted in US ITC memory chip probe
    On March 27, the US International Trade Commission (ITC) launched an investigation into memory chip imports by SK Hynix Inc. and KIOXIA Holdings Corporation following a patent complaint...
    Thursday 26 March 2026
    Alibaba‑backed Tripo AI draws investor confidence, led by exec from Minimax
    Tripo AI, founded in 2023, is rapidly emerging in AI-driven 3D content creation, turning text prompts or 2D images into production-ready 3D models in seconds. Backed by major investors...
    Thursday 26 March 2026
    China's Naura and AMEC lead China's push into advanced chip packaging
    As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
    Friday 20 March 2026
    As NAND makers move on, MLC memory nears the end of the line

    As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance...

    Tuesday 17 March 2026
    Mech-Mind Robotics champions eyes and brains for embodied AI industry

    Mech-Mind Robotics, a leading provider of 3D vision systems and software for industrial robots, laid out its plans at Automation World (AW) 2026...

    Tuesday 17 March 2026
    eMMC shortage sends NAND prices soaring, with further gains ahead
    Supply disruptions in low-capacity eMMC are driving sharp price increases for SLC and MLC NAND as major global memory manufacturers exit older production nodes. Contract prices for...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook