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    For India's chip dream, Lam Research points beyond fabs
    13min ago
    China's cybersecurity AI charges ahead despite US model lockout
    24min ago
    DeepSeek's US$7bn funding bid puts China's AI race on notice
    38min ago
    Analysis: Intel's Apple deal boosts CEO Tan's turnaround, but hard part still lies ahead
    42min ago
    NEWS TAGGED 3D
    Monday 11 May 2026
    From Basement to Deep Space: How AON3D is Redefining High-Performance 3D Printing

    Montreal-based AON3D is setting a new standard through its mastery of high-performance materials and precision 3D printing technology.

    Wednesday 6 May 2026
    Taiwan researchers create non-toxic blue-light material that could enable glasses-free 3D displays
    Researchers at National Yang Ming Chiao Tung University announced a new non-toxic, metal-free light-emitting silicone that produces blue fluorescence when mechanically stressed, a...
    Wednesday 6 May 2026
    SoftBank, Intel target HBM limits with 9-layer memory
    SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
    Tuesday 5 May 2026
    Kioxia, SanDisk to unveil 3D flash architecture targeting 1,000-layer milestone
    Kioxia and SanDisk are set to present a new 3D flash memory architecture aimed at extending NAND scaling beyond 1,000 stacked layers, as memory makers seek ways to overcome the physical...
    Wednesday 29 April 2026
    Osense develops baseball hawk-eye system to capture US$10 billion sports tech market
    Taiwanese artificial intelligence (AI) software company Osense Technology is targeting the rapidly growing sports technology market — valued at more than US$10 billion —...
    Monday 27 April 2026
    Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
    Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
    Monday 27 April 2026
    NEO Semiconductor advances 3D DRAM with POC validation
    Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years...
    Sunday 26 April 2026
    Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling
    Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix,...
    Wednesday 22 April 2026
    SJSemi's blockbuster IPO reorders China's chip packaging landscape
    Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial...
    Monday 20 April 2026
    Odisha to break ground on India's first advanced 3D chip packaging unit
    Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous...
    Tuesday 14 April 2026
    JCET advances CPO, glass substrates to capture AI packaging demand
    JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
    Thursday 2 April 2026
    Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026
    Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D...
    Monday 30 March 2026
    DRAM scaling hits limits as next-generation memory faces delays

    The global DRAM industry is approaching a structural inflection point, as traditional scaling methods struggle to deliver the performance...

    Sunday 29 March 2026
    SK Hynix and Kioxia targeted in US ITC memory chip probe
    On March 27, the US International Trade Commission (ITC) launched an investigation into memory chip imports by SK Hynix Inc. and KIOXIA Holdings Corporation following a patent complaint...
    Thursday 26 March 2026
    Alibaba‑backed Tripo AI draws investor confidence, led by exec from Minimax
    Tripo AI, founded in 2023, is rapidly emerging in AI-driven 3D content creation, turning text prompts or 2D images into production-ready 3D models in seconds. Backed by major investors...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook