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NEWS TAGGED 3D
Monday 10 January 2022
AMD latest 3D desktop processor to adopt TSMC SoIC technology
AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...
Thursday 6 January 2022
YMTC promoting China homegrown SSDs
China's Yangtze Memory Technologies (YMTC) continues to grow its Zhitai-branded consumer SSDs utilizing YMTC's in-house developed 3D TLC NAND chips, with the newly-developed TiPro...
Thursday 30 December 2021
Solomon uses AI 3D vision to control robotic arms
Solomon Technology has applied AI-based 3D vision software to control the movement of multiple robotic arms to reach harmonious collaboration among them, according to company chairman...
Wednesday 29 December 2021
CHPT optimistic about probe card demand for 3D ICs
Probe card demand for 3D ICs is promising, according to IC testing interface solution provider Chunghwa Precision Test Tech (CHPT), which also claimed it will be one of the new suppliers...
Wednesday 29 December 2021
Taiwan testing and analysis companies stand out in 3D chiplet, third-gen semiconductors
Taiwan's semiconductor supply chain will bring the biggest benefits to homogeneous/heterogeneous packaging, system-level testing (SLT), as well as advanced technology for materials...
Monday 6 December 2021
Memory demand to boom for AI, says Macronix chairman
Memory demand is set to rise further, as AI applications become more widespread, according to Miin Wu, chairman for ROM and flash chipmaker Macronix International.
Wednesday 1 December 2021
Supply chain cooperation crucial to address SiP challenges, says ASE VP
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
Wednesday 1 December 2021
TSMC advanced packaging enters next phase of development, says company VP
TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...
Friday 26 November 2021
EDAs to play crucial role in upcoming 3D IC era
Going beyond Moore's Law has become an important force driving advanced semiconductor technology. Top companies such as TSMC, Samsung Electronics and Intel are all already seeing...
Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Tuesday 23 November 2021
Chipmakers ramping up 176-layer 3D NAND output
Major NAND chip vendors are ramping up their 176-layer 3D NAND chip output in the fourth quarter of 2021, which may bring supply-side variables in the first half of next year, according...
Thursday 18 November 2021
YMTC improving 128-layer 3D NAND flash manufacturing yields
China's Yangtze Memory Technologies (YMTC) is improving yield rates for 128-layer 3D NAND flash manufacturing, and is on track to scale up its monthly output to 100,000 wafers in...
Monday 15 November 2021
OSATs for handset 3D sensors, CIS see revenues fall in October
Taiwan-based backend houses Xintec and VisEra, both in the supply chain of 3D sensors for iPhone 13 series, saw their October revenues fall sequentially on a slowdown in shipments...
Thursday 11 November 2021
Macronix developing 3D NOR flash
Macronix International is engaged in the development of 3D NOR flash memory in-house, which is expected to bear fruit within two years, according to company chairman Miin Wu.
Wednesday 3 November 2021
AP Memory posts record 3Q21 profit
AP Memory Technology, a subsidiary of Powerchip Technology specializing in customized DRAM memory designs and IPs, has reported net profits of NT$676 million (US$24.2 million) on...