Samsung Electronics is reportedly adopting Molybdenum (Mo) for the metal wiring process in its ninth-generation 3D NAND (V9 NAND) technology.

As generative AI accelerates digital transformation across various industries, experts agree that future market competition will be defined by speed.

Amid the hype for liquid cooling in the server industry, Nidec Chaun-Choung Technology (CCI) chairman Junichi Nagai notes that the company will release liquid cooling solutions for...

Samsung Electronics is keenly exploring "hafnia ferroelectrics" as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers...

Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.

With the rise of Artificial Intelligence (AI), the NAND flash market is experiencing significant growth. This has reignited the competition between Samsung Electronics and SK Hynix...

ROM and flash memory maker Macronix International stayed in the red in the first quarter of 2024 with net losses amounting to NT$1.08 billion (US$33.2 million). Nevertheless, the...

Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless...

Innolux will showcase its Generative AI (GenAI) technologies at the 2024 Touch Taiwan, including a 3D printer with AI 3D imaging solutions and its "Chat-N-Go" AI Automated Guided...

Samsung Electronics is intensifying its efforts in developing next-generation 3D NAND Flash technology.

With air cooling being the mainstream solution at data centers, 3D Vapor Chambers (VCs) have successfully broken through the theoretical heat dissipation limitations of air cooling...