Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according...
Kioxia and Western Digital have revealed details of their latest 3D flash memory technology, showing their ongoing innovation collaboration. The 218-layer 3D flash memory uses advanced...
Recently, a South Korean research team successfully developed an AI semiconductor that can be used in mobile devices and can increase speed and energy efficiency. This result is anticipated...