Intel Labs, in collaboration with Blockade Labs, has introduced Latent Diffusion Model for 3D (LDM3D), a novel diffusion model that uses generative AI to create realistic 3D visual...
On June 13, National Taiwan University Hospital (NTUH) and long-time partner Microsoft Taiwan jointly announced a mixed reality (MR) application project. The NTU Hospital team will...
Samsung Electronics and SK Hynix have revealed the latest development trends for advanced logic chips technology and memory products at recent technology symposiums, with the former...
Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric...
Micron Technology has introduced the Crucial Pro series, which consists of memory and storage products designed for gamers, content creators, workstation professionals, and anyone...
South Korean companies including LG Electronics are moving to collectively roll out augmented reality (AR) glasses with 3D images in cooperation with Qualcomm, and are expected to...
According to South Korea media ChosunBiz, citing Korean industry sources, SK Hynix is testing nano imprint lithography (NIL) equipment and conducting R&D associated with...
Neo Semiconductor has announced the release of 3D X-DRAM, the world's first 3D NAND-like DRAM, which the company believes would eliminate DRAM's capacity issue and replace the entire...
TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.
Apart from its TSMC-led silicon-based semiconductor ecosystem, Taiwan also plays a crucial role in the development of compound semiconductors, including the second-generation semiconductors...
