In the past six months, China's leading GaN compound semiconductor firm Innoscience has faced patent infringement lawsuits in Germany and the US, from power component manufacturers...
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
Zhen Ding Technology made its debut at SEMICON Taiwan 2024, where the company highlighted the expanding role of IC substrates in advanced semiconductor manufacturing.
Intel has been dealing with ongoing losses and is reportedly exploring various cost-cutting measures and monetization strategies for its foundry services. Meanwhile, SMIC, which also...
In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...
Six months ago, Intel CEO Pat Gelsinger introduced an ambitious "moonshot" initiative to match semiconductor manufacturing capacities in Europe and the US with those in Asia by 2030...
Nvidia's announcement that its Blackwell series will enter mass production in the fourth quarter signals a shift toward a new era in server cooling, transitioning from traditional...
VSO Electronics, a specialist in the development, production, and distribution of connection cables, is targeting six major industries for future developments, and has begun developing...
AI is bringing tremendous impacts on the semiconductor industry, creating challenges and opportunities that necessitate cooperation across the supply chain to create a sustainable...
Huawei's HiSilicon Full-Connection Conference is scheduled for September 9 in Shenzhen, just one day before Apple's annual iPhone launch event. While the timing's intent remains unclear,...
SK Hynix has announced the successful development of the world's first sixth-generation 10nm-class DRAM (1c DRAM), surpassing industry leader Samsung Electronics in achieving mass...
Google unveiled four new Pixel models, two of which have been released in Taiwan. The new foldable phone is set to launch on September 4, while the Pixel 9 Pro is scheduled for release...
Japanese semiconductor equipment manufacturers have experienced a significant revenue boost from China. However, with rising semiconductor investments in other markets like India,...
