According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
Taiwan Semiconductor Manufacturing Company (TSMC), the world's leader in pure-play foundry, basically said the impact of the April 3 earthquake was minimal in a statement on the evening...
Amid export restrictions imposed by the US and its allies and a move to indigenization, lithography equipment exports to China slowed in the first two months of 2024.
SEMICON China 2024, which was held in Shanghai on March 20-22, attracted many Japanese semiconductor equipment manufacturers to showcase their front-end and backend mature node process...
Chinese President Xi Jinping criticized "technological barriers" during Dutch Prime Minister Mark Rutte's visit to Beijing as the US pushes to tighten controls on ASML Holding NV's...
China is aggressively raising funds to support sustained double-digit annual growth in domestic chip production capacity and cultivate homegrown equipment development for import substitution,...
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027, after topping US$100 billion for the first time in 2025, driven...
While chip design giants like Nvidia, AMD, and Intel prioritize "system-level" integration, all the six major Taiwanese EMS providers – Foxconn, Wistron, Compal, Quanta, Inventec...
