Samsung Electro-Mechanics (SEMCO) told investors on October 28 that long-term agreements are expected to account for more than 60% of its multilayer ceramic capacitor (MLCC) revenue...
Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking...
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion...
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
AMD and Nvidia have separately invested in supply-chain capacity expansion, making substrates, packaging, and testing key priorities as AI demand diversifies. The moves show that chipmakers...
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...
Nvidia has unveiled a prototype of its next-generation co-packaged optics (CPO) technology, Optics-on-Interposer (OOI), at SEMICON West 2026. The design moves the optical engine from...
Rapid growth in AI-driven demand is placing new pressure on the printed circuit board (PCB) supply chain, with equipment constraints, shorter product...
Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet...
The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron,...
Growing demand for AI servers, advanced packaging, and data centers is reviving interest in idle LCD plants, with companies acquiring and converting existing sites into semiconductor...
Contrel Technology and FSE jointly showcased dual-core laser micromachining and plasma process technologies at TPCA Show 2026, targeting advanced packaging and high-end substrate manufacturing...
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
