Ajinomoto has informed IC substrate makers that it will raise prices for its key ABF build-up film by 30%, with the new pricing expected to take effect in the third quarter of 2026...
April results across Taiwan's electronics hardware supply chain underscored how deeply artificial intelligence infrastructure is reshaping demand patterns — from advanced materials...
The global copper-clad laminate market expanded sharply as AI computing demand forced higher-spec hardware, and Taiwan's printed circuit board supply chain moved to secure second-source...
As AI data centers demand ever-faster networking speeds and more advanced optical interconnects, one of the semiconductor industry's lesser-known materials is emerging as a major c...
The development of next-generation server memory DDR6 is reportedly entering early hardware validation, as memory makers and supply chain partners begin pre-development work ahead...
Rising raw material prices have pushed up gallium arsenide (GaAs) substrate costs, squeezing a key material used in power amplifiers (PA). Win Semiconductors said that its scale gives...
Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...
The memory industry cycle is on the upswing, driven by strong customer orders, rising OSAT prices, and high capacity utilization rates. Memory OSAT companies reported a surprisingly...
Driven by strong artificial intelligence (AI) and silicon photonics (SiPh) demand, optical communications epitaxy manufacturer LandMark Optoelectronics reported a more than sixfold...
Tong Hsing Electronic, a Taiwanese semiconductor packaging and substrate manufacturer specializing in CMOS image sensors, said on Monday that optical communication modules have become...
As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics...
Samsung Electro-Mechanics has reportedly secured a leading position in the supply chain for advanced substrates used in the Groq 3 language processing unit (LPU), a next-generation...
As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously,...
