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    Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion
    45min ago
    China's chip-tool localization accelerates: ACM Research backlog jumps 88%
    48min ago
    Four glass makers converge on 510x515mm substrate, hinting at TSMC’s next move
    Sep 30, 18:39
    NEWS TAGGED SUBSTRATE
    Thursday 1 October 2026
    BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
    China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced...
    Thursday 1 October 2026
    Machvision's dual-track strategy enters early growth as semiconductor, substrate visibility reaches 3 years
    Machvision said its "dual-track, four-line" strategy has entered an early growth phase as demand for AI servers, high-speed transmission, and advanced packaging continues to rise....
    Thursday 1 October 2026
    Unimicron expands ABF substrate capacity with NT$10B Hukou land deal
    Unimicron has moved again to ease tight ABF substrate supply, buying a Hukou site from Bridgestone Taiwan for more than NT$10 billion (US$313.65 million). The deal highlights how AI...
    Wednesday 30 September 2026
    Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant
    Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026,...
    Tuesday 29 September 2026
    Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion
    Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance...
    Tuesday 22 September 2026
    Daeduck nears long-term supply deals as Doosan expands capacity amid tight T-glass supply
    South Korea's PCB and semiconductor substrate supply chain is expanding capacity as demand from servers and data centers rises, with customers moving to secure long-term supply while...
    Monday 21 September 2026
    Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

    Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

    Monday 21 September 2026
    ByteDance's China AI chip push hits substrate shortage

    China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

    Monday 21 September 2026
    DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
    DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
    Friday 18 September 2026
    Resonac grows 300mm SiC crystal, marking a substrate milestone
    Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable...
    Thursday 17 September 2026
    Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag
    Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek...
    Thursday 17 September 2026
    DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027
    DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion...
    Wednesday 16 September 2026
    Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
    Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
    Tuesday 15 September 2026
    AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows
    Taiwan's copper-clad laminate (CCL) makers significantly outpaced printed circuit board (PCB) and IC substrate suppliers in August, as stronger server demand, pricing and product-mix...
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    GlobalExhibition
    BIZ FOCUS
    Oct 1, 08:00
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
    Thursday 1 October 2026
    From Excel to Editable Presentations: AI Streamlines Financial Reporting
    Wednesday 30 September 2026
    Hackathon Team Optimizes Urban Evacuation Decision-Making
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
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