Tong Hsing Electronic, a Taiwanese semiconductor packaging and substrate manufacturer specializing in CMOS image sensors, said on Monday that optical communication modules have become...
As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics...
Samsung Electro-Mechanics has reportedly secured a leading position in the supply chain for advanced substrates used in the Groq 3 language processing unit (LPU), a next-generation...
As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously,...
Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo,...
Semiconductor materials and equipment supplier Wah Lee Industrial reported record-high cumulative revenue for the first two months of 2026, fueled by strong demand for artificial intelligence...
Samsung Electro-Mechanics (Semco) is expected to supply ABF substrates for Tesla's next-generation artificial intelligence chips that Samsung Electronics plans to manufacture at its...
Rising geopolitical tensions and surging demand for AI applications are reshaping the global printed circuit board (PCB) industry. The Taiwan Printed Circuit Association (TPCA) notes...
Looking beyond advanced logic nodes, compound semiconductors have emerged as a strategic priority for applications ranging from power electronics and RF to optoelectronics.
Revenue data for January 2026 highlights uneven momentum across Taiwan's AI server supply chain, spanning power, substrate, and thermal management suppliers, and reflects shifting...
Surging demand for artificial intelligence servers and high-performance computing (HPC) has tightened capacity across the semiconductor supply chain. For many small South Korean communications...
PCB giant Zhen Ding Technology (ZDT) reported that despite the traditional consumer electronics off-season in the first quarter of 2026, strong demand for advanced AI products propelled...
Vanguard International Semiconductor (VIS) has signed a licensing agreement with Taiwan Semiconductor Manufacturing Company (TSMC) for high-voltage (650V) and low-voltage (80V) gallium...
Facing intense price competition from Chinese manufacturers in the silicon carbide (SiC) substrate market, Kenmec Mechanical Engineering's subsidiary TAISIC Materials is pursuing a...
